| Allicdata Part #: | ATS-17B-08-C3-R0-ND |
| Manufacturer Part#: |
ATS-17B-08-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-08-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17B-08-C3-R0 thermal-heat sinks is essential for circuitry that generates excessive heat. It is made of aluminum hydroxide material due to its lightweight and excellent heat transfer properties. The thermal heat sinks are provided with advanced bonding technology for superior performance and reliable heat sinking.
A good heat sink should be designed with excellent heat conduction properties in order to effectively dissipate the heat generated by the components to the outside environment. ATS-17B-08-C3-R0 thermal-heat sinks are equipped with heat pipe technology to enhance its cooling effect and reduce the heat generated by the circuitry.
The convenience of the thermal-heat sink is that it can be attached directly to the electronics circuitry. It is then connected with an external temperature control equipment that will maintain the temperature of the application within the predefined range. The main purpose of the thermal-heat sink is to withdraw heat from the hot spots of the circuitry and promote smooth and efficient running of the system.
The thermal-heat sink utilizes a sophisticated disperser design which maximizes the area of heat transfer to the air. This design makes sure that the maximum heat is removed from the circuitry and the temperature of the application is maintained within the predefined limits.
Once the internal temperature of the system is moderated, the thermal-heat sink will allow the generated heat to escape from the system without affecting the functioning of the system. In addition to this, due to its high torsion strength and ability to withstand extreme temperatures, the ATS-17B-08-C3-R0 thermal-heat sinks are suitable for various applications.
The ATS-17B-08-C3-R0 thermal-heat sink is widely used in mobile phones, computers and other electronic equipments due to its excellent qualities. Also, it can be used in industrial applications involving lasers, high-power LEDs or heating systems. By using this thermal-heat sink, an efficient cooling system can be established for the system which will preserve its original performance.
The thermal-heat sink is most effective when it is used with a temperature control equipment. With this device, the temperature of the system can be adjusted to the desired level. This will ensure that the system works at its optimum efficiency and produces stable output. This equipment can also be used to moderate system temperatures in order to prevent component damage from excessive heat buildup.
The specific data is subject to PDF, and the above content is for reference