| Allicdata Part #: | ATS-17B-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-17B-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components used in electronics as a way to dissipate heat produced by electrical devices. This type of component is used in the application of microprocessors, integrated circuits and other applications that generate heat. ATS-17B-11-C3-R0 is a thermal-heat sink that uses aluminum fins, extruded aluminum base and copper heat pipes as cooling elements. The high thermal conductivity of each material enhances performance of the device and allows thermal dissipation of larger capacitors.
Application Field of ATS-17B-11-C3-R0
The ATS-17B-11-C3-R0 heat sink is designed for applications requiring low thermal resistance from high-power components. Its application field involves thermal management of digital systems, telecommunications and other components such as switching power supplies, voltage regulators and microprocessors. Due to its high thermal conductivity, it can be used to dissipate heat more efficiently in smaller footprints.
Working Principle
The ATS-17B-11-C3-R0 has three components: the aluminum fin heat sink, the extruded aluminum base and the copper heat pipe. The aluminum fin heat sink is formed into modules that consist of air-cooled fins and extruded aluminum base. The fin configurations are designed to ensure efficient thermal contact between the pipe and the surface of the component to be cooled. The copper heat pipe transfers the heat efficiently through capillary action and convection. The extruded aluminum base acts as a thermal interface between the heat sink and the component while also acting as a structural support.
Conclusion
The ATS-17B-11-C3-R0 is an effective thermal-heat sink designed to dissipate heat from various types of devices. Its aluminum fin heat sink, extruded aluminum base and copper heat pipe make it ideal for cooling and providing enhanced thermal management in a wide range of applications. Given its performance, this type of design can be used in a variety of applications that require an efficient, high-performance heat sink.
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