| Allicdata Part #: | ATS28222-ND |
| Manufacturer Part#: |
ATS-17B-127-C2-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-127-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.12650 |
| 10 +: | $ 4.01373 |
| 25 +: | $ 3.79058 |
| 50 +: | $ 3.56769 |
| 100 +: | $ 3.34473 |
| 250 +: | $ 3.12175 |
| 500 +: | $ 2.89877 |
| 1000 +: | $ 2.84303 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are some of the most important components in a variety of electronic products. They act like radiators, releasing heat generated by the electronics and ensuring proper operation of the components. The ATS-17B-127-C2-R0 is a type of thermal-heat sink that has a range of applications in several industries, most commonly in industrial and commercial equipment.
The ATS-17B-127-C2-R0 is a heat sink made of an aluminum-silicon alloy and measures 17mm x 127mm x 2mm. The heat sink has high thermal conductivity, and its profile is designed to promote efficient airflow and increased cooling. The ATS-17B-127-C2-R0 is designed for surface mounting and can be used in a variety of devices, including power supplies, high-performance amplifiers, LED lights, and power converters.
The ATS-17B-127-C2-R0 heat sink has a thermal resistance of 0.37°C/W and its performance is optimized for air flow of 3.5CFM. The thermal resistance of 0.37°C/W ensures that the heat sink can effectively dissipate heat from sensitive electronics and prevent them from over-heating. The optimized air flow of 3.5 CFM ensures that the heat generated by the components can be quickly dispersed, which reduces the risk of component damage due to overheating.
The ATS-17B-127-C2-R0 thermal-heat sink is designed to be used in a variety of applications. In consumer electronics, such as PCs, laptops, and tablets, the heat sink can help to keep internal components from overheating, improving performance and reliability. In automotive and aerospace industries, it can be used to protect sensitive electrical components from the effects of extreme temperatures. Additionally, it is often used to cool high-powered amplifiers, LED lights, and power converters.
The ATS-17B-127-C2-R0 thermal-heat sink\'s working principle is simple. The heat sink\'s aluminum-silicon alloy body absorbs the heat produced by the components and spreads it across its surface area. As the air passes over the heat sink, the thermal energy is transferred away from the components and dissipated into the surrounding air. By effectively dispersing heat, the heat sink helps to maintain the ideal operating temperature range for the diverse range of components and gadgets it is fitted to.
Heat sinks play an important role in the electronics and industrial industries, and the ATS-17B-127-C2-R0 thermal-heat sink is one of the most widely used. It features a high thermal conductivity and optimized air flow to effectively disperse heat generated by components. Additionally, the ATS-17B-127-C2-R0 can be used in a variety of applications, from consumer electronics to industrial and commercial equipment. As such, it is an essential component in any professional electronic setup.
The specific data is subject to PDF, and the above content is for reference