| Allicdata Part #: | ATS-17B-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-17B-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-17B-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electrical and electronic systems is an essential element for their proper functioning. Heat sinks are essential components of thermal management systems, which are used to dissipate heat from components to maintain optimal performance. The ATS-17B-145-C1-R0 heat sink is an effective component within thermal management systems and offers a range of useful features to ensure efficient heat dissipation.
The ATS-17B-145-C1-R0 is a surface-mounted aluminum heat sink compatible with thermal management components such as fans, blowers, and thermoelectric coolers. It has a lightweight and durable natural anodized aluminum construction, and its optimized fin design enables the heat sink to dissipate heat efficiently. The ATS-17B-145-C1-R0 also offers an easy installation process and includes multiple mounting options.
The ATS-17B-145-C1-R0 has a wide range of advantages for its application in a variety of thermal management systems including electronics, mobile devices, LED lighting, and computer chipsets. Its high thermal conductivity, low cost, and slim profile makes it ideal for applications where size and weight are important. Additionally, the ATS-17B-145-C1-R0 can be used in applications with high temperature requirements such as telecom and automotive industries.
The working principle of the ATS-17B-145-C1-R0 involves dissipating heat that is generated by the component it is attached to, away from the components and into the atmosphere. This is done by conduction and convection of the heat, while the airflow from nearby fans or blowers helps to enhance this process. The fins of the heat sink help to expose more surface area for better heat transfer. In effect, this decreases the temperature of the component, which in turn increases the component’s longevity.
In conclusion, the ATS-17B-145-C1-R0 is an efficient and cost-effective thermal management option for a wide range of applications. Its ability to dissipate heat efficiently and its lightweight design make it an ideal choice for any application requiring a reliable, compact heat sink. The working principle of the ATS-17B-145-C1-R0 allows it to effectively transfer heat to the surrounding environment, keeping components running at optimal performance.
The specific data is subject to PDF, and the above content is for reference
ATS-17B-145-C1-R0 Datasheet/PDF