ATS-17B-15-C1-R0

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Introduction

The ATS-17B-15-C1-R0 emerges as one of the most popular products from Thermal - Heat Sinks. This product is designed to efficiently transfer thermal energy from components to the environment. Its application field and working principles are explained in this article.

Application Field

The ATS-17B-15-C1-R0 is designed primarily for industrial purposes. It can be used in various industries including electronics, automotive, aerospace, telecommunications, medical and many other fields. It can also be applied to both personal and professional projects. The product is also suitable for applications where high heat dissipation is required. Its broad range of application fields allows for limitless possibilities.

The product can be used in various types of components such as heat pumps, computer processors, power supplies, graphical processors and so on. Due to its wide application scope, its use can be adapted to any kind of electronic application. Moreover, the product can be used in environmental measurement and control systems, medical equipment, electronic telephones, and data-storage devices.

Working Principle

The ATS-17B-15-C1-R0 uses a combination of heat dissipation technologies to transfer the heat from the component to its environment. It consists of a thermally conductive material layer, a heat sink base and a frame. The thermally conductive material layer contains a special layer of aluminum which is designed to efficiently dissipate heat from the component to the environment. The heat sink base, which is attached to the frame, works as a secondary component to absorb heat from the main component. The frame provides a steady position for the heat sink base and prevents it from sliding away from the main component. In addition, the frame also serves as a protection from different vibrations.

The heat is then transferred away from the component to the environment using the process of convection. The thermally conductive material layer transfers the heat from the component to the heat sink’s base. Due to the convection process the heated air passes through the base and rises up to the environment in an accelerated speed. By this principle, the heat is effectively dissipated from the components and efficiently transferred to the outside environment.

Conclusion

The ATS-17B-15-C1-R0 is designed for a wide range of applications and its flexibility allows for limitless possibilities. It is ideal for electronic applications where heat dissipation is essential. Its working principle is based on the process of convection, where the thermally conductive material layer efficiently transfers heat from the components to the heat sink’s base and is then transferred away to the environment. By this principle, the product ensures an effective and efficient heat dissipation and is certain to widely improve the performance of its applications.

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