| Allicdata Part #: | ATS-17B-171-C1-R0-ND |
| Manufacturer Part#: |
ATS-17B-171-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-171-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from an object and are a critical component in the operation of electrical systems. The ATS-17B-171-C1-R0 is a thermal heat sink designed to improve thermal performance and increase device longevity.
The ATS-17B-171-C1-R0 is a high-power thermoelectric heat sink made of aluminum and copper to dissipate heat. The aluminum provides high thermal conductivity while the copper adds rigidity and strength. The heat sink features a corrosion resistant aluminum-zinc-nickel plated finish for superior performance. The thermal performance of this heat sink is rated for up to 300 watts, making it suitable for a wide range of applications.
The ATS-17B-171-C1-R0 consists of two components, a boost and a base plate. The boost plate is designed to efficiently dissipate heat away from the device and into the surrounding environment, while the base plate fixed to the bottom of the device facilitates the exchange of heat between the device and the base plate. The heat created by the device is transferred through the boost plate and then into the base plate where it escapes into the surrounding environment through natural convection.
The ATS-17B-171-C1-R0 heat sink is ideally suited for use in a variety of applications including high-performance computers, high-power electronics, test equipment, medical equipment, military application, high-resolution displays, and more. It can also be used in a variety of power supplies, electric motors, and industrial machinery.
The ATS-17B-171-C1-R0 thermal heat sink is designed to increase the cooling efficiency of the device while reducing the overall operating temperatures. This allows the device to run at peak efficiency for longer periods of time and reduces the risk of device damage due to overheating. The long service life of the device is further improved due to reduced wear and tear associated with the increased cooling.
The ATS-17B-171-C1-R0 provides many benefits including increased thermal transfer efficiency, reduced noise levels, improved device longevity, and more. Its ability to increase thermal transfer efficiency also allows the device to function more reliably and with greater efficiency. The reduced noise levels make the device more appealing to users and less likely to cause disruption in the environment.
This thermal heat sink is a reliable and efficient option for a wide range of applications, and its superior construction and materials make the ATS-17B-171-C1-R0 an ideal choice for those seeking a reliable and efficient thermal heat sink solution.
The specific data is subject to PDF, and the above content is for reference