ATS-17B-176-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17B-176-C1-R0-ND

Manufacturer Part#:

ATS-17B-176-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17B-176-C1-R0 datasheetATS-17B-176-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-17B-176-C1-R0 application field and working principle

Thermal-Heat Sinks are among the most common way of heat dissipation in the electronic devices. The ATS-17B-176-C1-R0 is a typical example of this. It is designed to ensure power electronics and other embedded products remain under the required temperature range.The ATS-17B-176-C1-R0 belongs to the most general type of Thermal-Heat Sinks. It is shaped like an M. The M shape means that it has two faces, a front face and a back face. The thermal dissipation surface corresponds to the surface of the M and it consists of progressively spreading laminations.These laminations serve to increase the heat dissipation surface area thus allowing a greater amount of thermal energy to be absorbed. In fact, the heat sink heats up distributedly and then cooled down faster. As the heat dissipates, heat is transported through the fins, protecting the underlying components and materials from overheating. The combination of the M-shaped body of the heat sink and the fins’ laminations allows the ATS-17B-176-C1-R0 to dissipate heat efficiently. Additionally, its small dimensions and light weight enable it to be used in any electronic device or appliance. Furthermore, the heat sink meets the requirements in terms of mechanical strength and long-term reliability.The ATS-17B-176-C1-R0 is often used in electronic systems involving control systems, electromagnetic sensors, electric motor drives, digital signal processors (DSPs), IGBT circuits, and programmable logic controllers (PLCs). In order to ensure that it works correctly, it’s important to pay attention to the system master clock information when connecting the heat sink.The ATS-17B-176-C1-R0 heat sink also provides protection against radio frequency interference (RFI). The air gap between the fins provides a shielding wall between the RFI electronic equipment and any potential sources of RFI. In the end, it’s important to remember that the ATS-17B-176-C1-R0 thermal-heat sink should be applied in accordance with the applicable safety regulations and standards in order to ensure its optimal performance. It is also important to follow the manufacturer’s instructions when installing the heat sink in order to prevent any damage to the underlying components. Following these guidelines will help ensure optimum functioning and protection against potential risks.

The specific data is subject to PDF, and the above content is for reference

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