| Allicdata Part #: | ATS-17B-184-C1-R0-ND |
| Manufacturer Part#: |
ATS-17B-184-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-184-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important field of engineering that seeks to maintain optimal temperatures in electronic devices. Heat generated by running electronic components must be conducted away from the device in order to prevent overheating. A heat sink is an important addition to many components to facilitate this heat conduction away from the device. One such example of a heat sink is the ATS-17B-184-C1-R0.
The ATS-17B-184-C1-R0 is a type II heat sink used mainly in automated processing systems. It is made from a strong copper alloy allowing it to both dissipate and conduct heat away from the processor. Its construction is designed for easy installation and easy upgrade. The ATS-17B-184-C1-R0 is compliant with industry standards for compliance and reliability.
Typical applications of the ATS-17B-184-C1-R0 include Industrial PCs, Embedded PCs, Control Computers, Effect Control Computers, and Aerospace Computers. This heat sink is designed for both thermal and electrical protection of the device. Its effectiveness is enhanced by its three-layer construction, which includes aluminum fins to further disperse heat. The fins allow for larger surface area which helps in dissipating heat at a quicker rate.
In addition, the ATS-17B-184-C1-R0 has an integral fan to better circulate and remove the hot air effectively. The fan is equipped with a brushless DC motor to generate consistent power and low noise operation. The ATS-17B-184-C1-R0 also has an even pressure distribution system that applies a controlled pressure on the processor, thus helping to reduce stress and improve the reliability.
The working principle of the ATS-17B-184-C1-R0 is based on the principles of heat conduction. Heat is first generated by the electronic components in the device, then the heat is conducted away from the components via the heat sink. The heat sink is made from a copper alloy which is a great conductor of heat and has a large surface area. This allows the heat to be dissipated quickly and effectively. The integral fan also assists in the removal of the hot air from the device.
The ATS-17B-184-C1-R0 is an ideal choice for thermal management as it is designed for ease of installation and maximum efficiency. Its three-layer construction ensures optimal performance, while the even pressure distribution system helps to reduce stress and increase reliability. Furthermore, its integral fan further aids in the removal of hot air from the device. The ATS-17B-184-C1-R0 is an excellent choice for any thermal management system.
The specific data is subject to PDF, and the above content is for reference