ATS-17B-24-C1-R0

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A thermal-heat sink is an important component in the cooling of high-power-density electronic equipment. It is designed to absorb, conduct, convert, and/or dissipate the excess heat generated by the electronics. Thermal-heat sinks come in different shapes, sizes and materials, but they all have the same core purpose of cooling down and dissipating heat. The ATS-17B-24-C1-R0 is a heat sink specifically designed to dissipate the heat generated in high-power-density applications, such as motorized power tools, commercial building management systems, networking equipment, LED lighting modules, thermal imaging systems, military electronics, etc.

The first thing to know about the ATS-17B-24-C1-R0 is its construction. It is made up of two 2.9" fins with a 0.8" center core. The fins are constructed of aluminum with a copper base, and the core is constructed of copper with a black oxide finish. The design of the ATS-17B-24-C1-R0 ensures maximum surface area for cooling efficiency and its black oxide finish helps to increase corrosion protection. This combination of two materials makes the ATS-17B-24-C1-R0 especially effective at dissipating heat produced by the high-power-density applications it is designed for.

The ATS-17B-24-C1-R0 also features a universal mounting system that makes installation quick and easy. The heat sink comes with two different types of hardware: a mounting bracket and a stand-off clip. The mounting bracket attaches directly to the device, while the clip is used to attach the ATS-17B-24-C1-R0 securely to the bracket. This makes it easier to install and remove the heat sink from the device as needed.

The ATS-17B-24-C1-R0 also features a unique design feature that sets it apart from the competition. The heat sink features "active cooling slots" that allow air to flow freely around the heat sink. This helps to increase the heat dissipation rate of the heat sink, as the air helps to pull away the heat generated by the device. This design feature is especially beneficial for high-power-density applications where the heat dissipates quickly.

The ATS-17B-24-C1-R0 has a maximum temperature rating of 175°C, making it suitable for high-power-density applications. The combination of its large area and active cooling slots also makes it especially suitable for today’s high-electronics-density systems, as these systems generate large amounts of heat. Additionally, the ATS-17B-24-C1-R0 comes with a 5-year manufacturer’s warranty, ensuring that the level of service and quality that the company provides is uncompromising. All of these factors make the ATS-17B-24-C1-R0 an ideal choice for any high-power-density application.

In conclusion, the ATS-17B-24-C1-R0 is an excellent thermal-heat sink for dissipating the heat generated by high-power-density applications. Its construction of aluminum and copper ensures maximum surface area for cooling efficiency and its active cooling slots help to draw away the heat generated by the device. Its universal mounting system makes installation a breeze and its 5-year manufacturer’s warranty makes it an even more attractive choice. With all of these features, the ATS-17B-24-C1-R0 is an excellent choice for any high-power-density application.

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