ATS-17B-31-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17B-31-C3-R0-ND

Manufacturer Part#:

ATS-17B-31-C3-R0

Price: $ 5.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X5.84MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17B-31-C3-R0 datasheetATS-17B-31-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.96188
30 +: $ 4.68657
50 +: $ 4.41076
100 +: $ 4.13513
250 +: $ 3.85946
500 +: $ 3.58378
1000 +: $ 3.51486
Stock 1000Can Ship Immediately
$ 5.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.230" (5.84mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 25.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks constitute a major application field for ATS-17B-31-C3-R0, given it\'s versatile design and construction that exhibits superior thermal management capabilities. This type of heat sink offers a combination of features, including low thermal resistance, high thermal capacitance, plus very good performance at elevated temperatures up to 200°C.

The heat sink functions by use of a thermoelectric effect. The internal cavity is filled with a thermally conductive material that couples heat away from the heat source. The material has a thermal capacity that is considerably higher than aluminum materials due to the very low thermal resistance of the materials used. Additionally, the heat sink is designed with a fin array that allows for optimized heat dissipation.

The thermal management capabilities of the ATS-17B-31-C3-R0 are further enhanced by the inclusion of an integrated air flow management system featuring an external fan. This allows for higher air flow rates, resulting in improved cooling efficiency. The fan also helps reduce temperature gradients by ensuring a uniform air temperature is maintained throughout the heat sink.

These features make the ATS-17B-31-C3-R0 an ideal heat sink for applications requiring reliable, robust, and efficient thermal management. Examples of applications where the ATS-17B-31-C3-R0 can be employed in include high power electronics, such as LED lighting, automotive applications, as well as energy storage and power generation solutions.

Aside from its exceptional thermal management capabilities, the ATS-17B-31-C3-R0 also offers a high level of flexibility, enabling it to be configured for a wide range of applications. Its versatile design enables it to work with a wide range of components and materials, including plastic, stainless steel, copper, and aluminum. It also facilitates easy installation, allowing for rapid deployment in any application.

In conclusion, the ATS-17B-31-C3-R0 is a versatile and high-performing thermal – heat sink that offers an excellent thermal management performance. Its low thermal resistance, high thermal capacity, and fan integration make it an ideal solution for applications requiring reliable and efficient thermal management. Whether it is used for LED lighting, energy storage, automotive applications, or power generation, the ATS-17B-31-C3-R0 is a great choice for any thermal – heat sink application.

The specific data is subject to PDF, and the above content is for reference

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