| Allicdata Part #: | ATS-17B-49-C1-R0-ND |
| Manufacturer Part#: |
ATS-17B-49-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-49-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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THERMAL-HEAT SINKS
A thermal-heat sink is a device used to dissipate heat from one or more pieces of equipment into a surrounding medium. This is accomplished through the transfer of heat from the equipment or device to the surface of the heat sink, and then from the surface of the heat sink into the surrounding medium by thermal radiation and/or convection. Heat sinks are commonly used in electronics or electronic enclosures, as well as in various electrical and mechanical applications. Heat sinks are designed to be thermally conductive, and they can be made from a variety of materials, including metal, plastics, and composites.
ATS-17B-49-C1-R0 is a type of heat sink specifically designed for applications where improved thermal performance and reliability are critical. The ATS-17B-49-C1-R0 heat sink has a low profile that reduces its overall size, making it ideal for integration into small form factor equipment. This heat sink is made from aluminum alloy fins with a black oxide finish and offers superior thermal conductivity and corrosion resistance. It also features an efficient finite element analysis design to ensure optimal thermal performance.
The working principle of the ATS-17B-49-C1-R0 heat sink is based on the transfer of heat from the source material into its aluminum alloy fins. The increasing surface area of the fins facilitates this process, allowing heat from the source material to more rapidly dissipate and spread out into the surrounding environment. The use of an efficient finite element analysis design helps to ensure that the heat is distributed evenly, ensuring optimal thermal performance. The black oxide finish also helps to improve the thermal conductivity of the heat sink, further enhancing its ability to dissipate heat.
The ATS-17B-49-C1-R0 heat sink is designed for use in a variety of applications, including embedded systems, medical, communications, and automotive products. The low profile of the heat sink makes it an ideal choice for integration into systems with limited physical space, and its superior thermal conductivity and corrosion resistance make it well suited for applications requiring high performance and reliable operation. The superior design of the heat sink ensures that heat is dissipated quickly and evenly, ultimately reducing the risk of overheating and improving the overall performance and reliability of the system.
The specific data is subject to PDF, and the above content is for reference