ATS-17B-64-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28345-ND

Manufacturer Part#:

ATS-17B-64-C2-R0

Price: $ 4.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17B-64-C2-R0 datasheetATS-17B-64-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.13910
10 +: $ 4.02507
25 +: $ 3.80167
50 +: $ 3.57802
100 +: $ 3.35437
250 +: $ 3.13075
500 +: $ 2.90712
1000 +: $ 2.85122
Stock 1000Can Ship Immediately
$ 4.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices that facilitate heat transfer between the heat source and the surrounding environment, such as air, water, or other fluids. ATS-17B-64-C2-R0 is a heat sink specifically designed for applications that require high thermal cycling performance. This heat sink has a thermal resistance of 0.3°C/W, which means that it can efficiently dissipate heat from components. The design also helps to minimize air flow noise and improves air flow efficiency.

The ATS-17B-64-C2-R0 works by absorbing heat from an electronic device and dissipating it to the atmosphere, converting thermal energy into thermal power. As the heat flux rises, the heat sink absorbs the increased heat energy and transfers it to its outer fins, which helps to reduce the temperature around the device. This improves the air flow efficiency and also helps to reduce the noise from air flow.

The ATS-17B-64-C2-R0 is designed to provide superior thermal cycling performance in applications such as industrial, telecommunications, and commercial computing. Its superior thermal design allows it to absorb and dissipate heat more efficiently than other types of heat sinks, enabling it to cycle rapidly over a wide range of temperatures. This allows the device or system to maintain its performance under varying levels of heat and to ensure the reliability and longevity of its components, making it perfect for applications requiring superior thermal cycling performance.

The ATS-17B-64-C2-R0 is also designed to provide superior thermal efficiency and uniform air flow distribution. Its unique design features a pyramid shape that helps to evenly distribute the air flow, ensuring that there is no build-up of heat near the heat source. The pyramid design also serves as a protection against turbulent air flow, preventing the buildup of heat in areas where it does not belong.

The ATS-17B-64-C2-R0 is designed with an integrated fan thatprovides superior cooling performance. This fan utilizes a unique combination of airfoils and impeller blades to efficiently drawon a consistent and uniform air flow. This ensures that thefan is able to maintain proper temperature and conserveenergy, helping to extend the lifetime of the device.

The ATS-17B-64-C2-R0 is an ideal heat sink for applications that require superior thermal cycling performance. Its unique design ensures that it is able to efficiently absorb and dissipate heat to the atmosphere, helping to improve the air flow efficiency and reduce noise. Its integrated fan allows for a consistent, uniform air flow, providing consistent cooling performance and ensuring the device or system is able to maintain its optimal performance. With these features, the ATS-17B-64-C2-R0 is a perfect solution for applications that require superior thermal cycling performance.

The specific data is subject to PDF, and the above content is for reference

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