| Allicdata Part #: | ATS28351-ND |
| Manufacturer Part#: |
ATS-17B-70-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17B-70-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components of nearly any modern electronic device. Whether used in the creation of computer chips, telecommunications, medical equipment, or other industries, the need for efficient and reliable thermal management is essential. The ATS-17B-70-C2-R0 heat sink is a great example of a component that not only performs well, but is also cost-effective and easy to install.
At its core, the ATS-17B-70-C2-R0 is an aluminum fin, a heat spreader designed to dissipate heat from a surface or device. The aluminum fin is capable of providing an expansive surface area, allowing heat to dissipate across a large area. To maximize the surface area available, the ATS-17B-70-C2-R0 is designed with extended fins which are both thick and tall. These fins are coated with a black anodized finish, which further helps to increase the heat dissipation of the device.
The ATS-17B-70-C2-R0 is designed to fit into various applications, including electronics, refrigeration, and telecoms. With a nominal size of 70mm by 5mm, it can fit many applications with a broad range of power. Its versatile design and size also make it easy to install in tight, confined spaces. Its easy to attach mount via an appropriately rated screw also simplifies installation.
The working principle of the ATS-17B-70-C2-R0 is quite simple. Heat is transferred from the device or surface to the metal fins of the heat spreader. Heat is then dissipated across a larger surface area, reducing it to a safe temperature. The thermal resistance of the fins, combined with the aluminum anodizing film, helps maximize the rate of heat dissipation. The fins are also designed to help circulate the air surrounding the fins, resulting in a cooler and more effective thermal management system.
The ATS-17B-70-C2-R0 is capable of withstanding temperatures up to 80℃, while maintaining a low profile. This helps ensure the device or component it is cooling is not overloaded and will continue to function properly. Furthermore, the fin design is capable of withstanding extreme thermal conditions while also allowing for a more balanced airflow. This minimizes the chance of hotspots appearing on the device or component, allowing for a much more efficient and reliable system.
The ATS-17B-70-C2-R0 is an excellent example of an efficient and reliable thermal management system. With its simple design and easy installation, it is an ideal component for any electronic device or component requiring efficient cooling. The broad range of applications, combined with its robust design, make the ATS-17B-70-C2-R0 a great choice for any thermal management system.
The specific data is subject to PDF, and the above content is for reference