ATS-17B-72-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28353-ND

Manufacturer Part#:

ATS-17B-72-C2-R0

Price: $ 5.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17B-72-C2-R0 datasheetATS-17B-72-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.95810
10 +: $ 4.82328
25 +: $ 4.55540
50 +: $ 4.28740
100 +: $ 4.01946
250 +: $ 3.75150
500 +: $ 3.48354
1000 +: $ 3.41655
Stock 1000Can Ship Immediately
$ 5.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.11°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal technology has come a long way in recent years and is now an incredibly useful tool in various industries. Heat sinks, such as the ATS-17B-72-C2-R0, have become increasingly popular due to their ability to effectively and efficiently dissipate heat from complex electronic components. This article will provide an overview of the application field and working principle of the ATS-17B-72-C2-R0 thermal heat sink.

What is a Heat Sink?

A heat sink is an electronic device that is used to absorb heat and dissipate it from critical components in electronics. Generally, heat sinks are composed of aluminum and copper plates or piping and often contain fins to increase surface area and therefore increase heat dissipation. Heat sinks are most commonly used to dissipate heat from computer processors, power transistors, and other components in computer systems.

Application Field

The ATS-17B-72-C2-R0 is a particularly effective heat sink that can be used for a wide variety of applications. It is most commonly used in laptops and desktop computers as a way to draw heat away from the processor. This heat sink is also popular in high-performance gaming systems and other digital devices such as smartphones and tablets. The ATS-17B-72-C2-R0 is also used in audio and video equipment, telecommunications equipment, and other industrial and military applications.

Working Principle

The ATS-17B-72-C2-R0 thermal heat sink is composed of aluminum and copper plates and contains heat-conducting fins to maximize surface area and heat dissipation. Heat is transferred from the component to the fins of the ATS-17B-72-C2-R0 through direct contact. The heat is then dissipated from the fins into the environment via natural convection or through the use of a fan. The ATS-17B-72-C2-R0 is resistant to corrosion and has a lightweight compact design for easy installation.

Conclusion

The ATS-17B-72-C2-R0 thermal heat sink is an incredibly useful device for dissipating heat from sensitive electronic components. It is versatile and can be used in a wide variety of applications, including laptops, desktop computers, high-performance gaming systems and other digital devices. Its lightweight, corrosion-resistant design makes it an ideal choice for any application requiring effective heat dissipation. With its ability to effectively dissipate heat, the ATS-17B-72-C2-R0 thermal heat sink is an invaluable tool in any field requiring efficient heat transfer.

The specific data is subject to PDF, and the above content is for reference

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