ATS-17B-90-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17B-90-C1-R0-ND

Manufacturer Part#:

ATS-17B-90-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17B-90-C1-R0 datasheetATS-17B-90-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices used to remove excess heat from electric components and to dissipate it into the environment. Heat sinks are necessary for any electronic components generating large amounts of heat, as their lifespan can be drastically reduced, as well as their performance, when not properly cooled. To ensure sufficient cooling of devices, the material used to manufacture the heat sink is of the utmost importance.ATS-17B-90-C1-R0 is one of the most advanced heat sinks, designed specifically to handle greater levels of heat dissipation than standard aluminum or copper-based heat sinks. The ATS-17B-90-C1-R0 features an ultra-compact housing, high thermal conductivity, and excellent thermal resistance. The ATS-17B-90-C1-R0 features a unique combination of materials, which provide high thermal conductivity and high thermal resistance to dissipate more heat from the device than standard aluminum or copper-based heat sinks. The ATS-17B-90-C1-R0 employs a combination of a ceramic dielectric material, a finned copper heat sink, a ribbed aluminum frame, and high-efficiency fans to achieve better heat dissipation. The ceramic dielectric material is placed beneath the fins, providing an efficient thermal pathway. This material helps transfer the heat generated by the device to the air without losing too much energy in the process. The fins and frame are designed to act as a heat spreader. This helps spread the heat generated from the device evenly over a large area, allowing for better thermal control. The fans then help to circulate the air around the device, further dissipating the heat into the environment.This combination of materials and design makes the ATS-17B-90-C1-R0 one of the most effective heat sinks on the market. It offers superior performance and thermal efficiency, making it ideal for applications where excessive heat dissipation is required. Some of the applications for the ATS-17B-90-C1-R0 include consumer electronics, industrial computing and storage, data centers, and medical devices.In conclusion, the ATS-17B-90-C1-R0 heat sink is an effective and reliable solution for applications requiring superior heat dissipation. Its advanced combination of materials and design allows it to dissipate higher amounts of heat with greater efficiency and reliability. With its exceptional performance and thermal efficiency, the ATS-17B-90-C1-R0 is the perfect heat sink for those applications requiring superior heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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