Allicdata Part #: | ATS-17C-10-C1-R0-ND |
Manufacturer Part#: |
ATS-17C-10-C1-R0 |
Price: | $ 3.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-17C-10-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.28104 |
30 +: | $ 3.19242 |
50 +: | $ 3.01505 |
100 +: | $ 2.83771 |
250 +: | $ 2.66036 |
500 +: | $ 2.57169 |
1000 +: | $ 2.30565 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-17C-10-C1-R0 is a Thermal - Heat Sink. It is mainly used in industrial, electronics and computer applications and other fields where high thermal management is required. ATS-17C-10-C1-R0 provides a wide range of solutions for electronic components in terms of thermal management, including cooling, lamination and mounting.The key component of ATS-17C-10-C1-R0, the heat sink, is made from polycarbonate and aluminum materials, providing effective thermal management for electronic components and devices. Heat sinks are designed to dissipate heat away from the heat source, keeping the device cool. The efficiency of the heat sinking process is determined by its design. The ATS-17C-10-C1-R0 has been designed to provide maximum thermal efficiency.The heat dissipation of ATS-17C-10-C1-R0 is achieved by using air-filled fins above the base material. The fins allow air to flow around the base material, dissipating heat away from the heat source. The overall design of the fins ensures maximum efficiency of the heat dissipation.For efficient heat dissipation, ATS-17C-10-C1-R0 also features a number of other features, including a die-cast aluminum housing, thermally-efficient heat pipes, aluminum plates and a non-conductive surface. The thermally-efficient heat pipes effectively transfer heat away from the heat source, keeping it cool. The aluminum plates allow for greater surface area coverage, while the non-conductive surface ensures that no unwanted heat is absorbed into the environment.In addition to providing effective thermal management to electronic components, ATS-17C-10-C1-R0 is also designed to provide protection against dust and particles. Its aluminum housing ensures that dust and other particulates are kept away from the sensitive electronic components, while the non-conductive surface prevents these particles from entering the system.For maximum efficiency, ATS-17C-10-C1-R0 also uses the latest manufacturing technology, such as precision-machined thermally-efficient heat pipes and die-cast aluminum parts. This ensures that the maximum amount of heat is dissipated away from the heat source, while still providing protection against dust and other particles.Overall, ATS-17C-10-C1-R0 is the perfect choice for those looking for high thermal management in industrial, electronics and computer applications. Its innovative design and manufacturing techniques ensure maximum efficiency, while its protection against dust and particles ensures that sensitive components stay safe. When it comes to high thermal management, ATS-17C-10-C1-R0 has it all.
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