| Allicdata Part #: | ATS-17C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17C-10-C3-R0 is a component of the Thermal - Heat Sinks family. This type of unit is used to dissipate heat generated by electrical and electronic components, allowing them to operate more efficiently. This type of heat sink is suitable for applications where a large amount of heat needs to be removed and where a high level of efficiency is required. It is designed to provide improved performance compared to other heat sink designs.
In order to understand the working principle of ATS-17C-10-C3-R0, it is necessary to understand the physical laws that govern heat dissipation. Heat transfer is a process by which heat is transferred from one medium to another. Heat can be transferred by conduction, convection or radiation. In the case of heat sinks, heat is transferred from the heated component to the air or other cooling medium, usually via conduction.
The basic principle of operation of the ATS-17C-10-C3-R0 is that heat is conducted away from the component and transferred to the heat sink. Heat is conducted from the electronic components to the heat sink through the contact surface between the two objects. When the heat sink absorbs the heat, it is dissipated to the surrounding environment via convection and radiation. In this way, the heat generated by the component does not reach critical levels which could cause damage or overheating of the device.
The ATS-17C-10-C3-R0 is designed to provide a more efficient heat dissipation than other designs. It features an array of fins that increase the surface area available for dissipating heat. The greater the surface area that is available for heat transfer, the better the dissipation. This type of heat sink also features a higher level of precision when it comes to the contact between the hot components and the heat sink, allowing for more efficient heat transfer.
The ATS-17C-10-C3-R0 heat sink is an ideal choice for a variety of applications. It is suitable for use in the military and aerospace industries, as well as in commercial and residential electronics applications. It can be used for cooling components in high-performance engines, for cooling power semiconductors in power supplies, and for cooling high-power transistors and thyristors. It is also suitable for cooling heat-sensitive electronic components such as integrated circuits and microprocessors.
The ATS-17C-10-C3-R0 is a reliable and effective heat sink that is capable of dissipating large amounts of heat in a highly efficient manner. It is designed with precision and quality in mind to provide consistent performance. This type of heat sink is an ideal choice for applications where efficiency and reliability are critical.
The specific data is subject to PDF, and the above content is for reference