| Allicdata Part #: | ATS-17C-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-17C-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in many electronic devices, as heat dissipation is essential to keep devices running at optimal performance levels. One of the cornerstone technologies in this area is the ATS-17C-100-C1-R0, a heat sink designed specifically for the thermal management needs of various electronic devices. In this article, we will discuss the application field and working principles of the ATS-17C-100-C1-R0.
The ATS-17C-100-C1-R0 heat sink is designed for maximum thermal efficiency and reliability. It is made of extruded aluminum alloy, which provides excellent heat conduction with low-cost mass-production manufacturing. It has a variety of features that make it suitable for a wide range of electronic devices, ranging from consumer-grade laptops to industrial-grade computers. It can be used to dissipate heat from large components such as processors and memory chips, as well as small components such as resistors and relays. Its key features include an optimized heatsink surface area for maximum thermal efficiency, low-profile design for easy installation, and a rugged construction for long-lasting operation.
How does the ATS-17C-100-C1-R0 work? The heat sink utilizes the principle of convection to dissipate heat away from vital components. As heat is generated by a component, it flows away from the component and into the heatsink, where it is then dissipated to the surrounding air. To increase the efficiency of the heat dissipation, the design of the heatsink is optimized for better air-flow, and features such as fins and louvers are added to the surface to enable air to flow faster and more evenly across the entire surface. This helps to cool the components more quickly and efficiently. In addition, the ATS-17C-100-C1-R0 features a number of attachment points that allow it to be easily installed onto a wide range of machines.
The ATS-17C-100-C1-R0 heat sink is an excellent choice for thermal management needs in a wide variety of applications. Its low cost and high efficiency make it ideal for use in consumer-grade laptops, industrial-grade computers, mobile devices, and other electronic devices. The rugged construction and easy installation features make it suitable for long-term use in harsh environments. It is also highly resistant to corrosion, making it an ideal choice for applications that require frequent cleaning or exposure to moisture. Finally, the optimized heatsink surface area and optimized air-flow design ensure maximum thermal efficiency, allowing components to operate at optimal temperatures.
The ATS-17C-100-C1-R0 is a top-tier choice for thermal management needs in a wide range of devices. Its optimized heatsink surface area, low-profile design, rugged construction, and optimized air-flow design make it an excellent choice for a variety of applications. Its low-cost and high-efficiency make it an ideal choice for consumer-grade and industrial-grade applications.
The specific data is subject to PDF, and the above content is for reference