| Allicdata Part #: | ATS-17C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-17C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components used to dissipate heat from electronic components to prevent them from burning out. Without proper heat sinks in place, electronic components will not function properly and can even be damaged in extreme conditions. ATS-17C-117-C1-R0 is a particular type of heat sink that is used to dissipate heat from electronic components.
Application Field of ATS-17C-117-C1-R0
ATS-17C-117-C1-R0 is a heat sink that is specifically designed to dissipate heat from power electronics such as processors, graphics cards, and other high-power components. It is commonly used in industrial, consumer, automotive, and defense applications. Its size is suitable for use in small form-factor systems such as embedded systems. It is also commonly used in computers, data centers, telecommunication systems, medical equipment, and military systems.
Working Principle of ATS-17C-117-C1-R0
The ATS-17C-117-C1-R0 heat sink is made from aluminum alloy. It features anodized fins that help to dissipate heat much more quickly than traditional heat sinks. It also has a set of mounting holes at its base that allow it to be easily installed onto the component it is cooling. The design of the ATS-17C-117-C1-R0 heat sink enables it to maintain a steady and efficient airflow over its entire surface.
The ATS-17C-117-C1-R0 heat sink uses a process called convection cooling to dissipate heat from electronic components. To do this, it relies on air flow, either natural or forced, through the heat sink fins. As the air flow moves past the fins, the heat from the component is absorbed and transferred to the aluminum fins themselves. As the air flow continues through the fins, the aluminum fins help to dissipate the heat away from the component, effectively cooling the component.
Conclusion
The ATS-17C-117-C1-R0 is an excellent choice for cooling power electronics in any application. It is designed to maximize heat transfer from the component it is cooling and is suitable for use in a variety of applications. Its efficient convection cooling process is effective in dissipating the heat away from the electronic component, making it a great choice for any power electronics application.
The specific data is subject to PDF, and the above content is for reference