ATS-17C-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17C-12-C1-R0-ND

Manufacturer Part#:

ATS-17C-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17C-12-C1-R0 datasheetATS-17C-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential aspect of any electronics system. The ATS-17C-12-C1-R0 is a heatsink that is designed specifically for use in electronic systems that require efficient cooling. This product is designed to be used with higher power components, such as microprocessors and memory modules. It allows for better heat-dissipation than other standard heatsinks, while also providing a low profile design that can fit into tighter spaces.

The ATS-17C-12-C1-R0 features a rectangular aluminum block with fins on one side. The block is specifically designed to maximize heat transfer, while the fins provide a larger surface area for more effective cooling. It also features an innovative fanless design, eliminating the need for a fan installation. This design helps keep noise levels down and eliminates the potential for dust and other contaminants to enter the system. The heatsink is also extremely reliable, with a long lifespan and low maintenance requirements.

The ATS-17C-12-C1-R0 is most suitable for applications that require effective cooling in a confined space or with components that generate a lot of heat. Examples of such applications include industrial controls, telecommunications systems, medical equipment, and consumer electronics. It is also ideally suited for applications in which the efficiency of cooling is of paramount importance. This is due to its fanless design and the fact that its fins help evenly distribute the heat.

The ATS-17C-12-C1-R0 achieves its cooling capabilities through a process called conduction, where heat is conducted from one medium to a second medium. Heat from the components is transferred to the aluminum block of the heatsink, which then acts as a heat conductor. The heat is then transferred to the fins of the heatsink, where it is dissipated into the surrounding air. The fins also help create a convection current in the air around them, which further helps dissipate the heat.

Overall, the ATS-17C-12-C1-R0 is an ideal solution for thermal management in high-performance electronics systems. It integrates a fanless design, a rectangular aluminum block, and fins to effective

The specific data is subject to PDF, and the above content is for reference

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