| Allicdata Part #: | ATS-17C-122-C1-R0-ND |
| Manufacturer Part#: |
ATS-17C-122-C1-R0 |
| Price: | $ 3.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-122-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.98368 |
| 30 +: | $ 2.90325 |
| 50 +: | $ 2.74201 |
| 100 +: | $ 2.58067 |
| 250 +: | $ 2.41940 |
| 500 +: | $ 2.33875 |
| 1000 +: | $ 2.09680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks ： ATS-17C-122-C1-R0 Application Field and Working Principle
Thermal management is a key component of modern electronics. Heat sinks are designed to dissipate generated heat from the hot components of the device, either through convection or radiation. Heat sinks come in many shapes and sizes, and vary in terms of performance, efficiency, and cost. The ATS-17C-122-C1-R0 thermal heat sink is a popular choice among engineers for its reliable performance, low cost, and ease of use. In this article, we will look at the application field and working principle of the ATS-17C-122-C1-R0.
Application Field Of ATS-17C-122-C1-R0
The ATS-17C-122-C1-R0 is a reliable and cost-effective heat sink made of aluminum extrusion. It is suitable for use in a range of electronics applications, especially those where space is limited or the heat needs to be dissipated quickly. Examples of such applications include embedded systems and personal electronics such as laptops, tablets, and smartphones. The ATS-17C-122-C1-R0 can also be used in automotive electronics, including in-vehicle infotainment systems, instrument panels, and Advanced Driver Assistance Systems (ADAS) components.
Working Principle Of ATS-17C-122-C1-R0
The ATS-17C-122-C1-R0 is designed to dissipate heat from a hot component, such as a processor or IC, through convective cooling. The heat is conducted from the component to the heat sink where it is then dissipated into the surrounding air. This is achieved through fin structures, which increase the surface area of the heat sink and increase the rate of heat exchange. The ATS-17C-122-C1-R0 is also designed to minimize airflow obstruction, allowing for efficient airflow and cooling.
Summary
The ATS-17C-122-C1-R0 thermal heat sink is a popular choice among engineers for its reliable performance, low cost, and ease of use. It is suitable for use in a range of electronics applications, particularly those where space is limited or the heat needs to be dissipated quickly. The ATS-17C-122-C1-R0 is designed to dissipate heat from a hot component through convective cooling, via fin structures that increase the surface area of the heat sink and increase the rate of heat exchange. It is also designed to minimize airflow obstruction, allowing for efficient airflow and cooling.
The specific data is subject to PDF, and the above content is for reference