| Allicdata Part #: | ATS-17C-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-17C-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-17C-139-C1-R0 Thermal – Heat Sink Introduction
Thermal – Heat Sinks are designed to improve heat dissipation and prevent system and component damage caused by the accumulation of heat. The ATS-17C-139-C1-R0 Thermal – Heat Sink is a type of low-profile heat sink that is designed to provide excellent heat dissipation in both air-cooled and liquid-cooled systems. This article details what the ATS-17C-139-C1-R0 Thermal – Heat Sink is, its application fields and working principles.
ATS-17C-139-C1-R0 Thermal – Heat Sink Overview
The ATS-17C-139-C1-R0 Thermal – Heat Sink is designed for cooling electrical and electronic components in high-temperature applications. This heat sink is made of aluminum alloy, which makes it lightweight and corrosion-resistant. It is also available in different sizes and thicknesses for a wide range of applications. It also features a unique low-profile design that ensures improved heat dissipation. In addition to thermal conductivity, the ATS-17C-139-C1-R0 Thermal – Heat Sink also has excellent electromagnetic interference (EMI) shielding to protect sensitive components from electromagnetic interference.
ATS-17C-139-C1-R0 Thermal – Heat Sink Application Fields
The ATS-17C-139-C1-R0 Thermal – Heat Sink is suitable for use in a wide range of applications in a variety of industries, including electronics, communications, automotive, medical, consumer electronics, military and many more. It can be used for a number of purposes, including cooling high-performance processors, power amplifiers, motherboards, LEDs, power supplies, modems, computer peripherals, etc. This heat sink can also be used in low-temperature applications, such as cooling water-cooled systems and even in liquid-cooled systems.
ATS-17C-139-C1-R0 Thermal – Heat Sink Working Principle
The ATS-17C-139-C1-R0 Thermal – Heat Sink utilizes a unique low-profile design to ensure efficient heat dissipation. This heat sink works by transferring the heat generated by the device into the aluminum alloy structure, which in turn dissipates it throughout the body. With the help of fans, the heat is transferred to the air, where it is dissipated quickly and efficiently. The ATS-17C-139-C1-R0 Thermal – Heat Sink also features electromagnetic interference (EMI) shielding to protect sensitive components from the harmful effects of electromagnetic interference.
Conclusion
The ATS-17C-139-C1-R0 Thermal – Heat Sink is an ideal thermal solution for a wide range of applications. It is lightweight, corrosion-resistant, and features a unique low-profile design to ensure improved heat dissipation. In addition to providing efficient cooling, this heat sink also features electromagnetic interference (EMI) shielding to protect sensitive components. Therefore, this heat sink is an excellent choice for use in electronics, communications, automotive, medical, consumer electronics, military and many other industries.
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