ATS-17C-145-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17C-145-C1-R0-ND

Manufacturer Part#:

ATS-17C-145-C1-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17C-145-C1-R0 datasheetATS-17C-145-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.68°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-17C-145-C1-R0 Application Field and Working Principle

Heat sinks are one of the most commonly used components in a multitude of products and systems. They are designed to absorb and dissipate heat generated due to electronic components or devices and thus reduce the overall system temperature and improve its performance. The ATS-17C-145-C1-R0 heat sink is one such product belonging to the Thermal-Heat Sink category. This article explores the application field and working principle of the ATS-17C-145-C1-R0 heat sink.

Application Field

The ATS-17C-145-C1-R0 heat sink is ideal for devices that require efficient heat dissipation and cooling such as CPUs, GPUs, power amplifiers, microcontrollers, etc. It can also be used for cooling larger and heavier components like RF transistors, power control modules, and more. Some of the major industries where the ATS-17C-145-C1-R0 heat sink is being employed include aerospace, automotive, industrial, communication, medical, and military.

Working Principle

The ATS-17C-145-C1-R0 heat sink design is based on a concept known as thermal conduction. It is made up of a large number of highly efficient and precise heat-dissipating fins (or hoops) that are arranged in bundles. Each hoop is made by spinning from a single piece of aluminum or copper rod. The hoops are arranged in a special wave formation which leads to a broad surface contact. This helps in evenly distributing the heat generated by the device in contact with the heat sink.

The main advantage of the ATS-17C-145-C1-R0 heat sink is its exceptional thermal performance, as compared to other heat sinks. This is because it has more surface contact area with the heat generating components, thus providing better heat conduction which in turn helps to lower the system temperature quickly and effectively. The ATS-17C-145-C1-R0 heat sink also offers superior durability and corrosion resistance due to its high-end aluminum or copper construction.

In conclusion, the ATS-17C-145-C1-R0 heat sink is a highly efficient and reliable cooling solution for many devices and systems that require robust thermal management. It offers superior thermal performance and durability due to its unique wave-like arrangement of highly efficient heat dissipating fins and its high-end aluminum or copper construction. As such, it is widely used in a variety of industries including aerospace, automotive, industrial, communication, medical, and military.

The specific data is subject to PDF, and the above content is for reference

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