| Allicdata Part #: | ATS-17C-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a vital role in the performance and reliability of electronic products. Excessive heat can lead to reduced performance as well as premature failure of most components. To control and manage thermal loads, manufacturers often turn to efficient cooling solutions such as heat sinks.
The ATS-17C-16-C3-R0 is a type of advanced thermal solution that utilizes efficient and reliable heat sink technology. It has a variety of applications, including computer, telecom, medical devices, and automotive electronics. The product is designed for use in a wide range of commercial and industrial applications.
Application Field of ATS-17C-16-C3-R0
The ATS-17C-16-C3-R0 features an advanced thermal design that provides superior thermal management for a variety of devices. It can be used to decrease the temperatures of high-performance processors and other components, allowing them to operate reliably and efficiently for an extended period of time.
This heat sink can also be used to reduce temperatures inside of closed-chamber environments. It is an ideal solution for equipment such as data centers, automotive systems, medical devices, and other sensitive electronic systems. In addition, it can be used to cool high-power electronics, such as server racks, laser systems, and robotics.
The ATS-17C-16-C3-R0 is also well-suited for applications that require improved cooling in a confined space. It is small and lightweight, making it easily mountable in tight spaces or enclosures. Its advanced design enables it to effectively absorb and dissipate heat without occupying too much space.
Working Principle of ATS-17C-16-C3-R0
The ATS-17C-16-C3-R0 utilizes a highly efficient technology known as “heat sink”. Heat sink technology is based on the principle of conduction cooling. Here, heat is conducted away from the processor or other components and absorbed and dissipated by the heat sink.
The ATS-17C-16-C3-R0 features a unique vented design, which allows for improved air circulation and cooling. This provides efficient thermal management and helps to reduce heat buildup inside of the system. The product also features an efficient design that features multiple air ports, allowing for improved thermal transfer.
The product also features high-gauge aluminum construction that is highly durable and reliable. This ensures that the device has a long service life and is able to withstand extreme temperatures. The product’s construction also helps to prevent corrosion, which is common in many heat sinks on the market.
Conclusion
The ATS-17C-16-C3-R0 is an advanced thermal solution that utilizes efficient and reliable heat sink technology. This product has a variety of applications, including cooling high-performance processors and other components, as well as providing improved cooling inside of closed-chamber environments. The product is also small and lightweight, making it easily mountable in tight spaces or enclosures. The ATS-17C-16-C3-R0 utilizes heat sink technology, which is based on the principle of conduction cooling. This efficient technology helps to reduce heat buildup and ensures that the product is able to provide long-lasting thermal management.
The specific data is subject to PDF, and the above content is for reference