ATS-17C-170-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-17C-170-C3-R0 Thermal- Heat Sink

A Thermal-Heat Sink, or simply an “Heatsink,” is a machine that is designed to transfer heat away from an object, particularly a processor or other electronic component. The ATS-17C-170-C3-R0 is a Thermal-Heat Sink product by ATS Corporation. It is a good, efficient, and reliable product for those looking for an efficient Thermal-Heat Sink solution.

Applications for ATS-17C-170-C3-R0

The ATS-17C-170-C3-R0 is designed for electronics components that require a reliable thermal-heat sink. It can be used in a variety of applications, such as for cooling of components in computers, servers, workstations, power supplies, and other technology-reliant products.The ATS-17C-170-C3-R0 is the perfect solution for those who require a heat-efficient and reliable product. It is capable of cooling components that can generate huge amounts of heat, such as those found in powerful graphics cards as well as high-end processor systems. It is also ideal for those who need a heating-cooling solution for high-powered PC components or in industrial applications.

Features and Benefits of ATS-17C-170-C3-R0

The ATS-17C-170-C3-R0 is easy to install and setup, and offers a range of features and benefits. The product is extremely durable and can handle large levels of thermal transfer. It also offers a highly efficient cooling application thanks to its special fin design. The fins are designed in such a way that it creates a more efficient cooling process that helps to protect electronic components from the risk of damage due to overheating. The product also features a silent fan operation that ensures the component does not suffer from unnecessary noise levels due to the fan operation.

Working Principle of ATS-17C-170-C3-R0

The ATS-17C-170-C3-R0 uses a simple yet effective method to transfer heat away from electronics components. The model has special ‘heat fin’ designs attached to the bottom of the Thermal-Heat Sink, which allows air to freely circulate around the fins. This enables the ambient air to be cooled by the fins, which takes away the heat from the heated components. The cooler air is then used to effectively cool the components.The ATS-17C-170-C3-R0 has a special fan and heat-pipe design to further help with the cooling process. The fan helps to move air across the fins, which helps to increase the cooling efficiency of the Thermal-Heat Sink. The heat-pipe design then helps to move the heat away from the component and out of the machine.

Conclusion

The ATS-17C-170-C3-R0 is a perfect example of a Thermal-Heat Sink. It is highly efficient, reliable, and easy to install and setup. Furthermore, it offers superior cooling abilities, thanks to its special fin design and fan operation. It is ideal for a wide range of applications, from PCs to industrial applications.

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