| Allicdata Part #: | ATS-17C-179-C1-R0-ND |
| Manufacturer Part#: |
ATS-17C-179-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-179-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential component of modern electronic devices. As the device power and density of the components increase, efficient heat dissipation becomes a more critical factor for long-term reliable operation of the system. The ATS-17C-179-C1-R0 is an efficient thermal heat sink that is designed to provide better cooling performance for high power electronics.
The ATS-17C-179-C1-R0 is a high-efficiency aluminum heat sink designed to provide the best cooling performance for high-power electronics. The heat sink utilizes a series of aluminum fins and a flat heat spreader to efficiently dissipate heat away from high-power components. The ATS-17C-179-C1-R0 has a mounting hole pattern that allows it to be easily attached to a variety of common mounting systems. The fins of the heat sink are also designed with multiple wicks that help to ensure that heat is evenly distributed across the fins. Additionally, the fins are formed with grooves that allow airflow to easily move through the fins, which helps to reduce the thermal resistance of the device.
The ATS-17C-179-C1-R0\'s working principle revolves around convection cooling technology. This technology makes use of the natural convection of air in order to dissipate heat away from the hot components in the system. The ATS-17C-179-C1-R0 is specifically designed to take advantage of this natural cooling mechanism. By using aluminum fins and grooves, the heat sink is able to create an efficient pathway for heat to flow from the hot component to the outside of the system. This is accomplished by having air move across the fins in a continuous cycle, removing hot air and cooling the components.
One of the benefits of using the ATS-17C-179-C1-R0 as a thermal heat sink is that it is highly efficient. The heat sink is able to dissipate approximately twenty times more heat energy than a conventional aluminum heat sink. This improved cooling performance is especially beneficial when dealing with high power electronics. Additionally, the ATS-17C-179-C1-R0 is extremely lightweight and can easily be integrated into any type of electronic-based system.
The ATS-17C-179-C1-R0 is an efficient and reliable thermal heat sink solution for a wide range of applications, including LED light panels, gaming consoles, high-power CPUs, and more. The ATS-17C-179-C1-R0 is designed to provide excellent thermal performance and long-term reliability. Its lightweight and efficient design makes it an ideal choice for applications where space and cooling requirements are a primary concern.
The specific data is subject to PDF, and the above content is for reference