
Allicdata Part #: | ATS-17C-179-C3-R0-ND |
Manufacturer Part#: |
ATS-17C-179-C3-R0 |
Price: | $ 4.02 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.65526 |
30 +: | $ 3.45198 |
50 +: | $ 3.24904 |
100 +: | $ 3.04592 |
250 +: | $ 2.84286 |
500 +: | $ 2.63980 |
1000 +: | $ 2.58903 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-17C-179-C3-R0 is a thermal heat sink that is used in many industries. It is a device that removes excess heat from a system and helps maintain a cooler temperature. This thermal heat sink is commonly used in the electronics, automotive and industrial markets, among others.
The thermal heat sink is formed from aluminum and has two main components: a base and a thermal plate. The base is used to mount and secure the thermal plate to the mounting surface. This base is mounted onto a substrate or PCB using screws and nuts. The thermal plate is then attached to the base and a heat-dissipating plate is placed between the thermal plate and the base.
The thermal plate is designed to be flush with the mounting surface and allows for optimal heat dissipation due to the large surface area exposed to the air. The thermal plate is also designed with louvers which help to create air movement around the thermal plate. The heat-dissipating plate is designed to quickly absorb and dissipate heat away from the system.
The ATS-17C-179-C3-R0 thermal heat sink is designed to transfer heat energy away from its surface to the surrounding air. This is accomplished by the combination of two methods, convection and radiation. Convection is the process by which heat energy is transferred between a hotter and cooler object through the transfer of air molecules. This is achieved through the louvers which help to create an airflow, and the dissipation of heat by the thermal plate, which allows the heat energy to be absorbed from the source. Radiation involves transferring heat energy through waves that travel through the air.
The ATS-17C-179-C3-R0 thermal heat sink is designed for use in various applications including computer systems, power supplies, LED lighting applications, medical equipment, and automotive electronics. Its use in these applications is necessary due to their extremely high operating temperatures. By dissipating the heat energy away from the system, the components within the system will remain cooler and be more reliable. In addition, the use of the thermal heat sink can reduce the amount of noise generated by the system due to reduced air turbulence due to the efficient transfer of heat away from the system.
The ATS-17C-179-C3-R0 thermal heat sink is an essential part of any system or application where temperature control is critical. It has proven to be a reliable and efficient device for removing excess heat energy and maintaining cooler temperatures in many industries. Its combination of convection and radiation heat transfer makes it an efficient thermal transfer device, allowing for the removal of high amount of heat energy from the system without creating too much noise.
Overall, the ATS-17C-179-C3-R0 thermal heat sink is an essential component that helps maintain cooler temperatures in a variety of applications and industries. Its efficient thermal transfer capabilities make it a reliable and efficient device for removing excess heat energy. This ensures that the components within the system remain cooler and more reliable, and that the system operates at optimal temperatures.
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