ATS-17C-196-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17C-196-C3-R0-ND

Manufacturer Part#:

ATS-17C-196-C3-R0

Price: $ 3.47
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X6MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17C-196-C3-R0 datasheetATS-17C-196-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.15063
30 +: $ 3.06516
50 +: $ 2.89498
100 +: $ 2.72462
250 +: $ 2.55435
500 +: $ 2.46919
1000 +: $ 2.21376
Stock 1000Can Ship Immediately
$ 3.47
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.26°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-17C-196-C3-R0 is a thermal-heat sink, a component used to dissipate heat from an electronic device to its environment. This particular type of heat sink is designed with a wide range of application fields and uses various working principles to effectively transfer heat away from an electronic device and into the environment.

At the heart of the ATS-17C-196-C3-R0 is a base plate and a pair of fins which are designed to work together to help dissipate the heat. The base plate acts as a base for the attachment of the fins, which form a large surface area that helps to spread the heat throughout the system. The fins are also able to effectively absorb heat, helping to further dissipate it away from the device. Thus, the ATS-17C-196-C3-R0 is able to effectively transfer heat away from an electronic device without compromising the performance of the device.

The ATS-17C-196-C3-R0 also uses other methods to help dissipate heat away from an electronic device. These methods include convection, the use of Faraday cages to trap heat energy, and the use of air flow to cool the fins. Convection is the process of transferring heat from the device to the air. In this case, the ATS-17C-196-C3-R0 uses a fan to suck hot air away from the device and force the cooler air back around the fins. The Faraday cage method traps heat energy in the fins, preventing it from radiating out into the environment. Finally, the air flow method uses a fan to blow air around the fins, thereby cooling them and further dissipating heat away from the device.

The ATS-17C-196-C3-R0 has a wide range of applications, from desktop computers to industrial production processes. In terms of electronics, the ATS-17C-196-C3-R0 is especially effective for devices which generate a large amount of heat, such as GPUs or CPUs. It is also suitable for use in high-power applications, such as LED lighting, and specialised medical imaging systems. In industrial applications, the ATS-17C-196-C3-R0 can be used with mechanical systems such as pumps and conveyors, and can even be used with machines which produce high temperatures.

Overall, the ATS-17C-196-C3-R0 is a versatile thermal-heat sink which is capable of effectively transferring heat away from an electronic device. It is designed with a wide range of application fields in mind and uses different working principles to effectively transfer heat away from the device. Because of this, the ATS-17C-196-C3-R0 is ideal for a variety of applications, from desktop computers to industrial production processes.

The specific data is subject to PDF, and the above content is for reference

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