| Allicdata Part #: | ATS-17C-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of heat transfer device, and the ATS-17C-20-C3-R0 is a common example of this type of product.
The ATS-17C-20-C3-R0 is a high performance, electroplated heat sink made from high grade aluminium. It is designed for the cooling of electronic and optoelectronic components, and is suitable for use in a wide range of applications. The heat sink has a baseplate which is designed to provide maximum heat dissipation, and the finned section provides additional cooling surface area. Several types of mounting brackets are available for mounting the ATS-17C-20-C3-R0 to a variety of components.
The ATS-17C-20-C3-R0 has a number of features which make it a suitable choice for applications which require high performance cooling. It has high thermal conductivity and increased surface area, which helps to quickly and efficiently dissipate heat. The heat sink also has a high resistance to corrosion, which makes it suitable for use in harsh environments. In addition, the heat sink is lightweight and has a low profile, making it easy to install.
The ATS-17C-20-C3-R0 has a number of applications and is suitable for use in a variety of environments, including medical, industrial, consumer electronics and automotive. It can be used to cool everything from LEDs and other components used in electronics, to engines and other power-intensive devices. The heat sink can be used in a variety of configurations, allowing for a customized solution to cooling needs.
The working principle of the ATS-17C-20-C3-R0 is simple. Heat is generated by the components which need to be cooled, and this heat is transferred away from the components and dissipated into the surrounding environment by the ATS-17C-20-C3-R0. Heat is transferred away from the components due to the difference in thermal conductivity between the components and the heat sink, which creates a pressure difference. This pressure difference causes air to move, allowing the heat from the components to be transferred away to the external environment.
The ATS-17C-20-C3-R0 is an efficient and reliable heat transfer device, and can be used in a variety of applications to provide effective cooling solutions. The lightweight design and low profile make the heat sink easy to install and maintain, while the high grade aluminium and coating ensure that the heat sink is resistant to corrosion and can provide long-term performance.
The specific data is subject to PDF, and the above content is for reference