| Allicdata Part #: | ATS-17C-205-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-205-C3-R0 |
| Price: | $ 4.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-205-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.03704 |
| 30 +: | $ 3.81255 |
| 50 +: | $ 3.58823 |
| 100 +: | $ 3.36401 |
| 250 +: | $ 3.13974 |
| 500 +: | $ 2.91548 |
| 1000 +: | $ 2.85942 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks: ATS-17C-205-C3-R0 Application Field and Working Principle
The ATS-17C-205-C3-R0 is a type of thermal heat sink which uses the principles of thermodynamics to transfer and dissipate heat. Heat sinks are necessary components for cooling electronics as they are very effective in dissipating heat which would otherwise build up and damage the device. ATS-17C-205-C3-R0 heat sinks are designed to dissipate a high amount of heat away from a device or component quickly, and they are commonly used in many industries such as telecommunications, industrial engineering, and computer technology.
The working principle of the ATS-17C-205-C3-R0 is based on the laws of thermodynamics. As heat is applied to the device, the heat sink absorbs the energy and transfers it away from the device. The heat then dissipates from the heat sink into the surrounding air. Heat sinks are most effective when they have a large surface area which increases the rate of thermal conduction. The ATS-17C-205-C3-R0 has an anodized aluminum fin structure with several fins for maximum heat dissipation. The fins are spread widely apart allowing for maximum thermal conduction.
The ATS-17C-205-C3-R0 is most commonly used in consumer electronics and telecommunications systems. It is able to dissipate large amounts of heat quickly and efficiently, making it ideal for use with high powered electronic devices and components. In telecommunications, the ATS-17C-205-C3-R0 is used to safely dissipate the large amount of heat generated by electronic telecommunication systems. It is also used in industrial machinery and industrial computers which need effective cooling systems to prevent overheating or breaking down. In consumer electronics, the ATS-17C-205-C3-R0 is used to improve the performance of high powered audio and video devices.
The ATS-17C-205-C3-R0 offers many benefits to its users. It is very efficient in the transfer and dissipation of heat, offering improved performance for electronic systems and devices. It is also compact and lightweight, making it easy to install in many different devices and systems. The ATS-17C-205-C3-R0 is also affordable and can be purchased from a variety of different suppliers. As a result, it is a popular choice for many different industries as it is able to safely and effectively dissipate large amounts of heat with minimal cost.
The specific data is subject to PDF, and the above content is for reference