
Allicdata Part #: | ATS-17C-35-C3-R0-ND |
Manufacturer Part#: |
ATS-17C-35-C3-R0 |
Price: | $ 5.53 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 36.83X57.6X5.84MM T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.97385 |
30 +: | $ 4.69749 |
50 +: | $ 4.42109 |
100 +: | $ 4.14477 |
250 +: | $ 3.86845 |
500 +: | $ 3.59213 |
1000 +: | $ 3.52306 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 1.450" (36.83mm) |
Width: | 2.267" (57.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.230" (5.84mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 22.55°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is critical for today’s electronics technology. While electronic components often generate large amounts of heat, they must still be kept within certain temperature ranges in order to continue working properly and reliably. Thermal management products, such as heat sinks, must be implemented to effectively dissipate heat away from the component so that it can continue running safely and optimally.
One of the most commonly used thermal management products is ATS-17C-35-C3-R0 passive heat sink. This heat sink is made from high-grade aluminum with a black anodized finish. It is designed specifically for decreasing the temperatures of heat sensitive components, such as CPUs, GPUs and other microprocessors. It is an effective cooling solution due to its excellent thermal conductivity, its ability to dissipate heat quickly, and its relatively low cost.
The ATS-17C-35-C3-R0 heat sink has a variety of applications. It is most commonly used for cooling CPUs, GPUs, chipsets, and other heat emitting components in PCs, workstations, servers, and other electronic equipment. It is also used in a variety of applications such as drone navigation, automotive electronics, satellite communication systems, and industrial robots. In all of these applications, the heat sink is able to effectively reduce the temperatures of the components and maintain their reliability.
The ATS-17C-35-C3-R0 heat sink is also ideal for cooling components in applications that require low noise levels. This is due to its unique design that uses a combination of fins and heat spreaders to quickly and silently dissipate heat to the surrounding environment. Its low-noise operation makes it perfect for applications that require low noise levels, such as medical equipment or even home audio/video equipment.
The ATS-17C-35-C3-R0 heat sink works using the principles of convection and conduction. Heat is generated from the component and is then transferred to the heat sink via conduction. The heat is then dissipated to the surrounding environment via convection. The heat sink\'s fins help to increase the surface area of the heat sink and maximize its heat dissipation capabilities by allowing more of the surface area to come into contact with the air, which helps to dissipate the heat faster.
In summary, ATS-17C-35-C3-R0 is a highly effective passive heat sink that is commonly used in a variety of applications. This heat sink is made from high-grade aluminum and features a black anodized finish, making it an attractive option for cooling systems. The heat sink works using the principles of convection and conduction, which allow it to effectively dissipate heat away from components and maintain their functionality. It is perfect for applications that require low noise levels and can be used for cooling CPUs, GPUs, chipsets, and other heat emitting components in a variety of applications.
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