| Allicdata Part #: | ATS-17C-37-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-37-C3-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-37-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are an important component of various electronic devices. The ATS-17C-37-C3-R0 is a high-performance thermal-heat sink used in a variety of applications, such as computers, servers, control systems, and industrial automation systems. In this article, we will discuss the application field and working principle of the ATS-17C-37-C3-R0.
The ATS-17C-37-C3-R0 utilizes a two-piece construction, consisting of a base component that attaches directly to a heat source, and a top component that dissipates the heat away from the source. This two-part construction allows for easier installation and maintenance, and reduces the overall size of the sink. The base component is made of aluminum alloy with a high-efficiency powder coating, while the top component is made of aluminum alloy with an advanced heat-dissipation panel. Combined, these two components provide excellent thermal performance.
The application field of the ATS-17C-37-C3-R0 is primarily in the field of computers, servers, and control systems. Its two-part construction is designed to efficiently dissipate heat from processors, GPUs, and other internal components, allowing for quieter and cooler operation. It can also be used with solid-state drives and other storage drives, as well as in automotive and industrial automation systems.
The working principle of the ATS-17C-37-C3-R0 is simple. As heat is generated by components inside the computer, it travels up the heat conduction path and up into the top component, which is made up of aluminum alloy with an advanced heat-dissipation panel. This panel dissipates the heat away from the heat source, thus keeping the device cooler.
When using the ATS-17C-37-C3-R0, it is important to ensure that it is secured properly and that the surrounding environment is suitable for heat dissipation. Additionally, the sink should be inspected periodically to ensure that it is performing correctly. If any damage or deterioration is detected, the sink should be replaced as soon as possible.
The ATS-17C-37-C3-R0 is a high-performance thermal-heat sink offering excellent thermal performance for a variety of applications. It utilizes a two-piece construction, consisting of a base component that attaches directly to a heat source and a top component that dissipates the heat away from the source. The working principle of the ATS-17C-37-C3-R0 is simple; heat travels up the heat conduction path and up into the top component, which dissipates the heat away from the heat source. The application field of the ATS-17C-37-C3-R0 is primarily in the field of computers, servers, and control systems.
The specific data is subject to PDF, and the above content is for reference