ATS-17C-81-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-17C-81-C3-R0 is a thermal heat sink that is designed to dissipate high levels of heat generated from various types of electronic components. It consists of a single finned aluminum extrusion which helps to maximize heat dissipation. The ATS-17C-81-C3-R0 is an ideal solution for cooling components such as processors, power supplies, and amplifiers. It is also commonly used in servers, computer towers, and other electronic appliances.

Application Field

The ATS-17C-81-C3-R0 is often used in a variety of electronic applications. It is an ideal choice for processors, which often generate more heat than other components. It can also be used in power supplies to improve power output, and in amplifiers to reduce thermal distortion. Other applications include servers, computer towers, and other electronic appliances.

Working Principle

The ATS-17C-81-C3-R0 is an ideal solution for dissipating heat generated from electronic components. Heat is transferred from the component to the heat sink via air or a liquid such as water. This process occurs through thermal conduction, convection, or a combination of the two. The thermal conductivity of the aluminum used to make the ATS-17C-81-C3-R0 ensures that heat is efficiently transferred away from the component, as aluminum has a high affinity for heat. Additionally, the finned design of the ATS-17C-81-C3-R0 helps to increase the surface area available for heat transfer which improves the overall effectiveness.

Benefits

The ATS-17C-81-C3-R0 offers a number of benefits over traditional air cooling solutions. Firstly, it is more efficient at dissipating heat from components, as heat is transferred through thermal conductivity, convection, or a combination of the two. This ensures that heat is quickly and efficiently transferred away from the component, reducing the risk of thermal damage. The finned design also helps to maximize the surface area available for heat transfer, increasing its overall effectiveness.

Conclusion

The ATS-17C-81-C3-R0 thermal heat sink is an ideal solution for dissipating heat generated from components found in a variety of electronic applications. It consists of a single finned aluminum extrusion which helps to maximize the surface area available for heat transfer. The ATS-17C-81-C3-R0 is an ideal choice for electronics that generate large amounts of heat, such as processors and power supplies, and is often used in servers, computer towers, and other electronic appliances.

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