| Allicdata Part #: | ATS-17C-83-C3-R0-ND |
| Manufacturer Part#: |
ATS-17C-83-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17C-83-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.63195 |
| 30 +: | $ 3.43014 |
| 50 +: | $ 3.22837 |
| 100 +: | $ 3.02665 |
| 250 +: | $ 2.82487 |
| 500 +: | $ 2.62310 |
| 1000 +: | $ 2.57265 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are critical in the operation of all types of electronic equipment and devices. Heat sinks, which are engineered and designed to transfer and disperse heat away from sensitive materials and components, are an often-overlooked crucial component of critical systems and subsystems. The ATS-17C-83-C3-R0 heat sink is a reliable and durable solution for thermal management. This article will look at the application field and working principle of the ATS-17C-83-C3-R0.
The ATS-17C-83-C3-R0 is a low-profile, fin-stacked heat sink with a base size of 17"x83"x3". Its air-flow efficient design consists of epoxy-coated aluminum fins with a uniform 0.165" fin spacing. This configuration ensures the most efficient heat transfer with minimal turbulence, thereby optimizing heat dissipation. The entire heat sink is plated with copper to maximize the thermal transfer capability. The ATS-17C-83-C3-R0 is specifically designed for applications requiring very low noise levels such as medical imaging systems, telecommunications, datacom, or test and measurement systems.
The primary application field of the ATS-17C-83-C3-R0 is the dissipating of heat produced by electronic components within a confined space. When current is passed through an electronic component, heat is generated as a by-product, and thus it must be dissipated in order to maintain optimal working temperature. Heat sinks are designed to provide this dissipating action, and the ATS-17C-83-C3-R0 is exceptionally suited to this purpose.
The main principle behind the heat dissipation capability of the ATS-17C-83-C3-R0 is convection. Convection is the process by which heat is transferred from one point to another through the movement of fluids. In this case, the fluid is air. With the ATS-17C-83-C3-R0, air-cooling is made possible through its air-flow efficient design, which consists of epoxy-coated aluminum fins spaced at a uniform 0.165" interval. Heat is pulled away from the source component, such as an IC, and is guided through the fins to other cooler areas in the system.
The ATS-17C-83-C3-R0 heat sink is an effective and reliable thermal management solution that is suited for multiple applications. Its air-flow efficient construction facilitates optimal heat dissipation, making it an ideal choice for use in systems or subsystems requiring maximum heat transfer with minimal noise levels.
The specific data is subject to PDF, and the above content is for reference