
Allicdata Part #: | ATS-17D-101-C1-R0-ND |
Manufacturer Part#: |
ATS-17D-101-C1-R0 |
Price: | $ 4.27 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X30MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.84048 |
30 +: | $ 3.62691 |
50 +: | $ 3.41347 |
100 +: | $ 3.20015 |
250 +: | $ 2.98680 |
500 +: | $ 2.77346 |
1000 +: | $ 2.72012 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-17D-101-C1-R0 Thermal - Heat Sinks are widely used in many industries today, from aviation to automotive to home electronics. They are designed for efficient heat transfer, providing the ability to rapidly disperse excessive heat away from crucial components, which not only increases the lifespan of these components but also improves their operating performance. This article will examine the application fields and working principle of ATS-17D-101-C1-R0 Thermal - Heat Sinks.
Application Fields of ATS-17D-101-C1-R0 Thermal - Heat Sinks
ATC-17D-101-C1-R0 Thermal - Heat Sinks are designed primarily for use in high-powered electrical and electronic components that require additional cooling. This could include a range of products from servers and computer components to amplifiers, solar panels, and any other device that generates large amounts of heat. In addition, ATS-17D-101-C1-R0 Thermal - Heat Sinks can be used in high-temperature environments to prevent components from overheating and burning out.
Due to their ability to quickly absorb and dissipate heat, ATS-17D-101-C1-R0 Thermal - Heat Sinks are frequently used in automotive components and avionics. They can be attached to the radiator, engine block, or electronic control units which are typically located in enclosed spaces, and help improve the lifespan of the components. In addition, they are often used in industrial equipment and laboratory instruments to help maintain a stable temperature, which is critical for accurate and reliable performance.
Working Principle of ATS-17D-101-C1-R0 Thermal - Heat Sinks
The design of an ATS-17D-101-C1-R0 Thermal - Heat Sink is quite simple — it consists of a series of fins connected to a base plate. These fins are designed to increase the surface area of the sink so that more heat can be transferred away from the component. The base plate, which attaches the sink to the component, is usually made of an aluminum alloy. An important part of the design is a heat transfer layer that is created between the fins and the base plate, which helps to quickly conduct the heat away from the component.
When the component generates heat, the heat transfer layer quickly dissipates the heat away from the component and into the fins of the sink. This causes the air around the fins to be heated, which causes the air to rise and create a cooling draft. This cooling draft then draws fresh, cool air into the fins and helps to further cool the component.
When the component is no longer generating heat, the heat sink gradually cools down as the air inside the fins is replaced with cooler air. The efficiency of the sink will depend upon the design and material used — for example, sinks with thicker and denser fins will provide superior heat dissipation.
Conclusion
The ATS-17D-101-C1-R0 Thermal - Heat Sink is a versatile and reliable heat dissipation solution for many industrial and consumer applications. It has a simple yet effective design which carries heat away from components quickly and efficiently, helping to prolong the life of the component and improve its performance.
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