
Allicdata Part #: | ATS28616-ND |
Manufacturer Part#: |
ATS-17D-125-C2-R0 |
Price: | $ 4.24 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X10MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.84930 |
10 +: | $ 3.74787 |
25 +: | $ 3.53934 |
50 +: | $ 3.33119 |
100 +: | $ 3.12304 |
250 +: | $ 2.91483 |
500 +: | $ 2.70663 |
1000 +: | $ 2.65458 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.92°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are an integral part of many electronic systems. Thermal heat sinks absorb heat from electrical components, dissipating it away from the component and other surrounding components, thus preventing the heat from becoming excessive and causing damage. The ATS-17D-125-C2-R0 is a thermal heat sink which is used in a variety of applications.
The ATS-17D-125-C2-R0 has a copper base and a copper core, which enhances both its heat transferring and dissipation capabilities. The copper core heats up quickly and evenly, providing maximum heat dissipation. The copper fins and fins tips transfer the heat away from the component, while the ribbed bottom adds strength and rigidity to the structure. The fins are also designed in such a way as to maximize airflow and allow for the efficient cooling of components.
In terms of applications, the ATS-17D-125-C2-R0 thermal heat sink is primarily used for cooling system components. This includes CPUs, GPUs, memory modules, as well as other semiconductor components such as diodes, phototransistors, and even motor controllers. It can also be used in lighting systems, cooling of electrical motors, and other applications in which excess heat is generated and needs to be dissipated as quickly and efficiently as possible.
Moreover, the ATS-17D-125-C2-R0 can also be used in automotive applications where the thermal heat sink is needed to keep temperatures under control in order to prevent overheating of the engine and other components. The same applies to aircraft and other vehicles, where proper cooling is a must in order to keep temperatures down and ensure a smooth operation.
Regarding its working principle, the ATS-17D-125-C2-R0 is designed to absorb, store, and dissipate. Incoming air from the atmosphere is heated up by the copper core, while the surrounding fins dissipate the heat away from the component and into the atmosphere. This principle of heat absorption, storage, and dissipation is what makes this heat sink efficient and reliable in a variety of applications.
In conclusion, the ATS-17D-125-C2-R0 is a thermal heat sink that is designed to efficiently absorb, store, and dissipate heat away from the component, preventing overheating and ensuring reliable operation. It has a copper base and core, as well as copper fins and fins tips, providing maximized heat absorption, an increase in air flow, and excellent heat dissipation. The ATS-17D-125-C2-R0 is used in a variety of applications, such as cooling of semiconductor components, aircraft, automobiles, lighting systems, and more. Its working principle is based on the absorption, storage, and dissipation of heat via the copper elements and fins, making it an effective and reliable thermal heat sink.
The specific data is subject to PDF, and the above content is for reference