| Allicdata Part #: | ATS-17D-132-C3-R0-ND |
| Manufacturer Part#: |
ATS-17D-132-C3-R0 |
| Price: | $ 5.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-132-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.70799 |
| 30 +: | $ 4.44612 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component of any electronics system, providing critical cooling to maintain temperatures within the operating range of the electronics. The ATS-17D-132-C3-R0 heat sink is a thermal product with excellent heat dissipation and low power consumption. This article will explore the application field and working principle of the ATS-17D-132-C3-R0.
The ATS-17D-132-C3-R0 is designed for use in ambient temperatures of up to 105°C, making it an ideal choice for high-temperature applications. It is compatible with a wide range of processors and chipsets from Intel, AMD, and NVIDIA, and is suitable for use with a variety of heating elements, such as Peltier devices, thermoelectric coolers, and heat pipes. It features a low-profile design, which allows it to fit into tight spaces, and its slim profile minimizes airflow interference.
The ATS-17D-132-C3-R0 has excellent thermal conductivity and heat dissipation properties, making it an ideal choice for a variety of applications. It features a high-efficiency fin structure, which ensures efficient cooling even at the highest temperatures. Additionally, its thin fins are designed to minimize airflow interference, ensuring efficient cooling without impeding the air flow. It also features a copper core, which provides efficient heat dissipation and helps to keep temperatures inside the device under control.
The ATS-17D-132-C3-R0 uses a unique cooling system, which utilizes a combination of convection and conduction to dissipate heat quickly and efficiently. This cooling system helps to maintain temperatures within the specified limits, and it also ensures that heat is quickly dissipated from the system, reducing the risk of overheating and damage to the electronics. The ATS-17D-132-C3-R0 is a reliable and efficient solution for any electronics system.
The ATS-17D-132-C3-R0 is an extremely versatile heat sink, which can be used in a variety of applications. It is suitable for computer systems, telecommunications equipment, industrial machinery, and a range of other applications. It is also ideal for use in high-temperature environments, as it provides excellent heat dissipation and low power consumption. The ATS-17D-132-C3-R0 is an excellent choice for any application requiring efficient cooling and low power consumption.
The ATS-17D-132-C3-R0 is an innovative thermal solution, which provides exceptional cooling and low power consumption for any electronics system. Its low-profile design ensures that the device fits into tight spaces, and its thin fins are designed to minimize airflow interference. Additionally, the copper core provides efficient heat dissipation, while the unique cooling system ensures efficient heat dissipation even at the highest temperatures. The ATS-17D-132-C3-R0 is an ideal choice for any application requiring reliable cooling and efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference