ATS-17D-156-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-17D-156-C2-R0 Thermal - Heat Sinks Overview

Introduction

The ATS-17D-156-C2-R0 is a thermal solution designed for a wide range of applications where efficient heat transfer and low mounting profiles are critical. ATS-17D-156-C2-R0 thermal solutions are designed to provide efficient cooling for a variety of components and systems. The use of a thermal solution allows for improved heat transfer and with its low mounting height, it is ideal for applications where space is a prime concern.

Application Field

ATS-17D-156-C2-R0 thermal solutions are suitable for use in a wide range of industries and applications. They are ideal for use in telecommunications, embedded systems, computers, and consumer electronics. The ATS-17D-156-C2-R0 thermal solution is also suitable for use in automotive, medical, and industrial applications.

Design Benefits

The ATS-17D-156-C2-R0 thermal solution has several advantages when compared to traditional cooling solutions. The design features a low mounting profile, which helps to conserve space. The unit is designed with a high thermal conductivity, which allows it to effectively and efficiently dissipate heat away from sensitive components. The thermal solution is also compatible with a wide variety of mounting techniques, further increasing its versatility and utility.

Working Principle

The basic principle behind an ATS-17D-156-C2-R0 heat sink is to provide a material that is highly thermally conductive to transfer heat from the device to the surrounding environment. Heat is transferred from the device to the heat sink by contact thermal conduction. This, in turn, draws the heat away from the device and dissipates it to the surrounding air, thus cooling the device. The air flow around the heat sink helps to further dissipate the heat more efficiently.

Material

The ATS-17D-156-C2-R0 heat sink is typically made from aluminum or copper. Aluminum has a strong combination of features, making it an ideal choice for thermal solutions. It is lightweight, cost-effective, and offers good corrosion resistance properties. Copper is also an ideal choice for thermal management because it offers excellent thermal conductivity and it can be plated for improved resistance to corrosion.

Finishing

The ATS-17D-156-C2-R0 heat sink is typically finished with a variety of protective coatings to improve corrosion resistance and reduce the risk of damage. Depending on the application, the heat sink can be powder coated, anodized, or epoxy coated. This finishing adds strength and durability to the heat sink, as well as an attractive appearance.

Conclusion

The ATS-17D-156-C2-R0 thermal solution is ideal for applications where efficient heat transfer and low mounting profiles are critical. It is suitable for use in a variety of applications and industries, including telecommunications, embedded systems, computers, consumer electronics, automotive, medical, and industrial applications. Its low mounting profile helps to conserve space and its high thermal conductivity allows it to effectively transfer heat away from sensitive components. The heat sink is typically made of aluminum or copper and can be finished with a variety of protective coatings to improve corrosion resistance and reduce the risk of damage.

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