ATS-17D-157-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-17D-157-C3-R0 is a thermal heat sink that is commonly used in a wide range of applications. The purpose of this product is to provide effective cooling for electronic devices and circuits. Heat sinks are popularly used in electronics, as they dissipate the heat generated by the components inside the device, helping them to function reliably and at maximum efficiency. This thermal heat sink is specially designed to handle the high temperatures generated by devices and components which require additional telecommunication applications, such as antennae and other wireless devices.

Application Field

The primary application field of the ATS-17D-157-C3-R0 thermal heat sink is in antennae and wireless device applications. This thermal heat sink is well-suited for telecom devices such as antennas, base stations, mobile handsets, and various other related devices designed to operate in both indoor and outdoor environments. They can help to dissipate heat, thus preventing damage to components from excessive heat buildup.Apart from antennae and wireless device applications, the ATS-17D-157-C3-R0 thermal heat sink is also suitable for a range of other applications such as monitoring and measuring equipment, computer peripherals, power supplies, and various other electronic components that generate heat. It is also sometimes used to dissipate excess heat for automotive and aerospace applications.

Working Principle

The ATS-17D-157-C3-R0 thermal heat sink is designed to remove heat from electronic components by dissipating it into the air. It consists of a metal base plate that is usually made of aluminum or copper, and a set of fins that are designed to provide additional surface area for heat transfer. The base plate is heated up by the electronic components, and the fins act to transfer the heat away from the base plate by convection.The heat is dissipated into the surrounding environment and is carried off by natural or forced airflows. The airflow is typically created by nearby fans, air conditioning units, or other mechanisms to help carry away the heat. The faster the air flow, the more efficient the process will be. The air will carry away the heat into the environment.

Categorization

The ATS-17D-157-C3-R0 thermal heat sink is classified as a thermal heat sink as it is designed to dissipate heat generated by electronic components in order to maintain optimal operating conditions. It is effective in providing cooling for devices and circuits that generate high temperatures due to intensive usage. This product can help to prevent the damage that high temperatures may cause to electronic components, making it an ideal solution for telecommunication applications.

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