| Allicdata Part #: | ATS28669-ND |
| Manufacturer Part#: |
ATS-17D-173-C2-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-173-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.62880 |
| 10 +: | $ 3.52800 |
| 25 +: | $ 3.33194 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-17D-173-C2-R0 Thermal Heat Sink is designed to help regulate the temperature of components in an electronic system. It is a device used to enable efficient dissipation of heat generated by several integrated components within the system. The ATS-17D-173-C2-R0 has a simple design, with an aluminum plate bonded to two extruded fins to achieve maximum heat dissipation to the ambient air. The combination of aluminum plate and fin structure helps to optimize the total thermal resistance from the heat source to the air.
The ATS-17D-173-C2-R0 is designed for applications in electronic enclosures with operating temperatures up to 105°C. Its aluminum fin structure has an airflow restriction of 0.43mm-H2O, providing enough cooling capacity for dissipating heat in most applications. The device features a low-profile design for easy integration into packaged systems. It also has four mounting anchor points on the aluminum plate for secure screw attachment. The combination of thin profile and lightweight makes the ATS-17D-173-C2-R0 one of the best thermal heat sink solutions for small and lightweight applications.
The ATS-17D-173-C2-R0 has proven to be highly reliable and efficient, enabling thermal management that is both cost-effective and energy efficient. Its superior construction and design, with an active area of 0.8-1.4mm2, allows a higher dissipation of heat and more efficient heat transfer. The device has a maximum power capacity of 85 W per cubic meter and a thermal resistance of 0.295°C/W. It also has excellent water resistance and is resistant to most solvents, oils, and dust particles.
The ATS-17D-173-C2-R0 has the capability to operate in a wide variety of applications, such as automotive, medical, and industrial environments. It is typically used for electrical enclosures, providing efficient heat dissipation solutions for high-power consuming components. Its compatibility with a variety of active and passive components also ensures optimal performance. The device is designed to offer superior thermal management performance for the long-term and helps to ensure system reliability even in harsh environments.
The specific data is subject to PDF, and the above content is for reference