| Allicdata Part #: | ATS-17D-175-C1-R0-ND |
| Manufacturer Part#: |
ATS-17D-175-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-175-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A heat sink, also known as a thermal pad, is an integral part of all electronics. It helps dissipate heat generated by components within the device, helping ensure that components remain within specified temperature ranges. Heat sinks are commonly used in computers, consumer electronics, industrial equipment, and medical devices. The ATS-17D-175-C1-R0 heat sink is a specific type of heat sink designed for applications requiring heat dissipation in tight spaces.
Application Field of ATS-17D-175-C1-R0
The ATS-17D-175-C1-R0 heat sink is designed for use in consumer electronic devices requiring heat dissipation in tight spaces, such as laptops and small form factor PCs. Due to its small size and lightweight design, it is ideal for applications where space is a limiting factor. In addition, its thermal performance is optimized for applications operating in the range of 0-110°C.
The ATS-17D-175-C1-R0 heat sink is designed for transistors, diodes, LEDs, logic chips, memory chips, CPUs, and GPUs. It can also be used with ICs, microprocessors, power MOSFETS, opto-couplers, memory chips, power ICs, and temperature sensors.
Working Principle of ATS-17D-175-C1-R0
The ATS-17D-175-C1-R0 heat sink works by transferring heat away from components within the device. Through the process of convection, heat is transferred from the component to the heat sink, where it is then dissipated into the surrounding environment. The heat sink consists of a base plate, which is connected to a series of radiating fins. As heat is transferred from the component to the base plate, the fins then act as a surface area for increased heat transfer, allowing for more efficient dissipation into the environment.
The ATS-17D-175-C1-R0 heat sink also features a unique thermal pad construction. The thermal pad is designed to ensure efficient heat dissipation from the components, while at the same time preserving the surface finish of the component. This ensures that the long-term performance of the components is not degraded due to heat soak.
Conclusion
The ATS-17D-175-C1-R0 heat sink is a highly efficient heat sink designed for applications requiring heat dissipation in tight spaces. Its unique thermal pad design ensures efficient heat dissipation while preserving the surface finish of components. The ATS-17D-175-C1-R0 heat sink is ideal for applications operating in the range of 0-110°C, such as laptops and small form factor PCs.
The specific data is subject to PDF, and the above content is for reference