| Allicdata Part #: | ATS28684-ND |
| Manufacturer Part#: |
ATS-17D-187-C2-R0 |
| Price: | $ 4.50 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-187-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.08870 |
| 10 +: | $ 3.97908 |
| 25 +: | $ 3.75782 |
| 50 +: | $ 3.53682 |
| 100 +: | $ 3.31582 |
| 250 +: | $ 3.09476 |
| 500 +: | $ 2.87371 |
| 1000 +: | $ 2.81844 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are among the most important components for a wide variety of electrical and electronic equipment. The ATS-17D-187-C2-R0 is a prime example and is used to reduce the amount of heat generated within the equipment. It does this by dissipating thermal energy into the atmosphere because of its thermal-conductive properties.
In more technical terms, ATS-17D-187-C2-R0 is a passive two-phase thermal management solution which includes a metallic heat-sink and its associated cooling system. This thermal management solutions’s performance is based on its thermal interaction with the target device or system, such as CPUs or other processor-based devices. Through an efficient combination of heat-sink, fan, and other cooling components, the ATS-17D-187-C2-R0 helps to lower the working temperature of the system or device, allowing the device or system to operate efficiently while suffering minimal heat damage.
The ATS-17D-187-C2-R0 has a general application in areas where it is important to keep the temperature of an area or device from getting too high. This includes any areas or devices that may generate a large amount of heat, such as CPUs, GPUs, and other processor-based devices. The ATS-17D-187-C2-R0 is also ideal for larger data centers or other large-scale setups where multiple devices generate a lot of heat. Additionally, it is also increasingly being used in consumer applications such as laptops, tablets, and mobile phones in order to protect them from overheating.
The ATS-17D-187-C2-R0 is designed with efficiency in mind. It utilizes a combination of a high-performance aluminum heat-sink and an efficient micro-fin cooling scheme to dissipate heat quickly and uniformly. This design results in a fast and reliable cooling solution that is both effective and economical. Additionally, the unit’s low profile design makes it suitable for tight spaces, making it ideal for applications with space constraints.
In summary, the ATS-17D-187-C2-R0 is a thermal management solution designed to provide effective cooling for a variety of high-powered and/or large processor-based devices. Its combination of high-performance aluminum heat-sink and an efficient micro-fin cooling scheme makes it an efficient and efficient solution for any space or device that is prone to overheating. Additionally, its low-profile design makes it suitable for use in tight spaces, making it a perfect solution for applications that require an effective cooling solution without taking up too much space. This makes it an ideal solution for those who need to reduce heat within their electronic devices or systems to ensure reliable and long-lasting performance.
The specific data is subject to PDF, and the above content is for reference