| Allicdata Part #: | ATS-17D-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-17D-195-C1-R0 |
| Price: | $ 3.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-17D-195-C1-R0 is a type of thermal-heat sinks, which are used to dissipate the heat generated by various components, either to extend their life or to cool them to a higher performance mode. A variety of sizes, shapes, and materials are used to provide a better performance in terms of heat transfer. This type of thermal-heat sinks is designed to be used as a more efficient means of cooling and dispersing heat generated by electronic components.
The main working principle of ATS-17D-195-C1-R0 is to transfer the thermal energy from one component to another. The thermal energy can be transferred from the part that is being heated, to a much colder heat sink. This heat transfer occurs when there is a temperature difference between the two components. The thermal-heat sink provides a channel for this transfer to occur, as it is designed to dissipate the heat generated.
ATS-17D-195-C1-R0 is typically used in electronic components including switches, capacitors, transistors, and LEDs. The thermal sink is also used in a variety of other fields, such as automotive, medical, or industrial applications. This type of thermal-heat sink also provides a better cooling solution compared to air or liquid cooling systems. It can greatly decrease the temperature of any device, thereby allowing it to perform better and longer.
ATS-17D-195-C1-R0 also has some different types of materials used in its construction. These materials can include aluminum, copper, steel, or ceramic. The materials used have different ranges of thermal conductivity, which will influence the performance of the heat sink. The materials also have different melting points, which will also affect the performance. The choice of material also affects the size, weight, mounting, and cost of the thermal-heat sinks.
In conclusion, the ATS-17D-195-C1-R0 thermal-heat sinks are an efficient performance-enhancing device. It has different construction materials, as well as different sizes, shapes, and mounting options. They are used in a variety of applications, including electronic components, automotive, medical, and industrial applications. It is an economical way to reduce the temperature of any device, thus allowing it to run more efficiently and for a longer time.
The specific data is subject to PDF, and the above content is for reference