ATS-17D-197-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-197-C1-R0-ND

Manufacturer Part#:

ATS-17D-197-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-197-C1-R0 datasheetATS-17D-197-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.80539
30 +: $ 2.72979
50 +: $ 2.57809
100 +: $ 2.42645
250 +: $ 2.27480
500 +: $ 2.19898
1000 +: $ 1.97149
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are designed to dissipate heat generated in electronic components and circuits. The ATS-17D-197-C1-R0 is a type of thermal heat sink that uses a combination of air convection and conduction to move heat away from the component.

The ATS-17D-197-C1-R0 is a single-piece, black-coated aluminum extrusion, designed to mount directly onto visual displays, components or sub-assemblies. It contains a series of vertical fins that extend from the mount to the top of the heat sink, creating a more efficient heat dissipation surface.

The ATS-17D-197-C1-R0 is designed to be used in a wide variety of electronic applications, including communications equipment, portable electronic devices, GPS receivers, cellular phones, computer chips, and more. The heat sink can be mounted directly on a visual display, component, or sub-assembly, and can be installed in a variety of configurations to suit the particular application.

The ATS-17D-197-C1-R0 uses a combination of air convection and conduction to move heat away from the component. As air passes over the finned surface of the heat sink, heat is dissipated into the air. The benefit of this type of thermal dissipation is that, unlike many other methods, the air is not heated. This allows the heat to be dissipated more quickly and more efficiently than with other technologies. Additionally, the fin design of the ATS-17D-197-C1-R0 helps to distribute the dissipation evenly over the surface of the heat sink.

The ATS-17D-197-C1-R0 is capable of dissipating up to 150 watts of heat. With its low profile design, the heat sink can be mounted in tight spaces or where clearance is limited. The aluminum construction allows for maximum heat transfer, while being lightweight and durable. The ATS-17D-197-C1-R0 is also RoHS-compliant, making it an environmentally friendly choice.

The ATS-17D-197-C1-R0 is an ideal choice for applications that require a reliable and efficient way to dissipate heat. With its combination of air convection and conduction, the ATS-17D-197-C1-R0 is capable of dissipating heat quickly and efficiently while still being lightweight and durable. The heat sink is capable of dissipating up to 150 watts of heat and can be mounted in tight spaces or environments where clearance is limited. With its low profile design and RoHS-compliant construction, the ATS-17D-197-C1-R0 is an environmentally friendly choice.

The specific data is subject to PDF, and the above content is for reference

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