ATS-17D-205-C2-R0

Thermal - Heat Sinks: ATS-17D-205-C2-R0 Application Field and Working Principle

Heat sinks are used for increasing the efficiency of electrical systems by providing large surface areas for heat to dissipate. Heat sinks are typically made from aluminum, copper, brass, and steel, and are designed to improve the cooling system of electronic components. The ATS-17D-205-C2-R0 is a heat sink product line from the ATS Thermal Products company, specifically designed for use in a range of industries.

Application Field and Common Uses

The ATS-17D-205-C2-R0 heat sink series is designed for use in a variety of industries, including aerospace, automotive, communication, electronics, gaming, general industry, medical, military, and transportation. Some common applications suitable for use with heat sinks from this product line include amplifiers, DC-DC converters, lasers, LEDs, mixed-signal ICs, power supplies, RF/microwave components, and voltage regulators.

Heat sinks are used across multiple systems, but the ATS-17D-205-C2-R0 product line is designed for use in applications that require low profile, high power density, and high thermal performance. Heat sinks from this product line are suitable for cooling a wide range of devices due to their low profile and high thermal performance. Additionally, the extended fin design of the ATS-17D-205-C2-R0 series increases the surface area for heat dissipation while still providing a low-profile solution.

Working Principle

A heat sink is a device used to dissipate thermal energy from a source, typically a computer component such as CPUs, GPUs, integrated circuits, or other electronic components. Heat sinks transfer thermal energy away from the source into its vicinity by utilizing convection and radiation. By transferring heat away from the source, the surface temperature of the heat sink will be reduced, which in turn decreases the temperature of the source.

The ATS-17D-205-C2-R0 series operates utilizing the same basic principles as other heat sinks. This heat sink product line utilizes an enclosed design, which creates an even distribution of air flow around the device, ensuring that each component on the sink is cooled effectively. The large fin surface area of the ATS-17D-205-C2-R0 series also ensures that large amounts of thermal energy can be dissipated quickly, making this product line ideal for use in high-powered applications.

Conclusion

Heat sinks are an essential component in today\'s electronic devices, and the ATS-17D-205-C2-R0 product line offers a high-performance, low-profile solution for cooling multiple types of electronic components. ATS-17D-205-C2-R0 heat sinks operate using the same basic principles as other heat sinks, utilizing convection and radiation to transfer thermal energy away from the source and reduce surface temperatures. Additionally, the enclosed design and large fin surface area of the ATS-17D-205-C2-R0 series offer high thermal performance and high power density, making this product line suitable for a variety of industries and applications.