| Allicdata Part #: | ATS-17D-206-C3-R0-ND |
| Manufacturer Part#: |
ATS-17D-206-C3-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-206-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.10634 |
| 30 +: | $ 3.87807 |
| 50 +: | $ 3.64997 |
| 100 +: | $ 3.42184 |
| 250 +: | $ 3.19372 |
| 500 +: | $ 2.96560 |
| 1000 +: | $ 2.90857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks have been gaining increased attention as a means of cooling electronic components and systems in a wide variety of applications. The ATS-17D-206-C3-R0 is a thermal-heat sink that is designed for use in a variety of applications. The design includes a rugged, low-profile aluminum fin body, along with a robust heat pipe design for outstanding cooling performance.
The ATS-17D-206-C3-R0 is designed to efficiently dissipate heat from an electronic component or system. The basic design of the unit includes a body constructed of an array of aluminum fins connected with a heat transfer medium (such as a heat pipe) that provides an efficient passage for heat transfer from the component or system being cooled. The fins are arranged in such a way that air is drawn through them by the natural convection of air, and the increased surface area maximizes the heat exchange between the fins and the surrounding air.
The heat sink design also includes a rugged, low-profile aluminum fin body, which has been designed to provide maximum heat transfer yet remain lightweight and durable. The design also includes a robust heat pipe layout, which helps to ensure excellent cooling performance and reliability. By using heat pipes instead of solid fins, a greater area of heat transfer is achieved and overall cooling performance is increased.
The ATS-17D-206-C3-R0 thermal-heat sink is designed to be used in a wide variety of applications. It is commonly used in computers and other electronic devices, as well as industrial systems such as electric motors, generators, turbines, and even automotive applications. In addition, the unit can also be used in a wide range of thermal management solutions for HVAC systems.
The ATS-17D-206-C3-R0 works by providing a more efficient path for heat transfer from the electronic component or system being cooled. Heat is drawn away from the component or system by the fins on the unit, which are arranged to provide maximum heat transfer yet remain lightweight and durable. The heat pipe layout helps to ensure excellent cooling performance and reliability, and the increased surface area maximizes the heat exchange between the fins and the surrounding air.
The ATS-17D-206-C3-R0 is an effective, cost-efficient solution for electronic device cooling. With its combination of efficient heat transfer, rugged construction, and low-profile design, the thermal-heat sink is an excellent choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference