ATS-17D-22-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.88°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Thermal Heat Sinks are an important element in any electronic application. Heat Sinks are designed to absorb heat, preventing it from accumulating in a single spot and causing damage or degradation of the components nearby. The ATS-17D-22-C3-R0 Heat Sink is a lightweight, aluminum-based electrothermal transfer device designed for various applications.

Construction

The ATS-17D-22-C3-R0 Heat Sink is constructed of 6063 aluminum alloy. This aluminum alloy provides excellent thermal conductivity, allowing the heat generated from the resistor to be effectively absorbed and dispersed to the surrounding air. The Heat Sink is black anodized for improved corrosion resistance and also provides improved thermal insulation. The Heat Sink has a sealed base which prevents moisture and dust from entering the device, thus ensuring a longer device life.

Design Features

The ATS-17D-22-C3-R0 Heat Sink has several design features that make it an ideal choice for various applications. The ATS-17D-22-C3-R0 features a large, open backplate which increases air circulation and heatsink efficiency. The Heat Sink has a lengthy, straight fin design which maximizes surface area and increases heat transfer efficiency. In addition, the Heat Sink features an adjustable mounting plate which allows for installation in various orientations.

Applications

The ATS-17D-22-C3-R0 thermal heat sink is ideal for a variety of applications. It can be used with resistors, transistors, LED applications, amplifiers and more. Additionally, the device is designed for use in closed spaces, including computers, gaming consoles, audio systems and other electronic equipment.

Working Principle

The ATS-17D-22-C3-R0 Heat Sink operates on the principle of electrothermal conduction. The aluminum alloy construction of the Heat Sink has excellent thermal properties which allow it to absorb heat from the resistor and transfer it to the surrounding air. This process is facilitated by the large backplate and fin design which maximizes air circulation and heat transfer. The anodized coating on the Heat Sink also serves to improve thermal insulation and thus further increase the efficiency of the device.The ATS-17D-22-C3-R0 Thermal Heat Sink is an important component in any electronic application. The device’s lightweight design, excellent thermal properties and adjustable mounting plate make it perfect for a variety of applications. The Heat Sink is designed to effectively absorb and disperse heat generated from electronic components, protecting them from damage or degradation.

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