| Allicdata Part #: | ATS28713-ND |
| Manufacturer Part#: |
ATS-17D-24-C2-R0 |
| Price: | $ 5.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17D-24-C2-R0 is an integral part of the Thermal - Heat Sinks category. This class of product is specifically designed to help regulate and control the temperature of electronic components and devices, whilst also helping to optimise performance and reduce overall energy consumption. The ATS-17D-24-C2-R0 is a common sight in many different areas of engineering, such as industrial and automotive.
The ATS-17D-24-C2-R0 is a single-stage, precise, combined active cooling and passive heat sink device. It consists of a combination of an integrated base plate and an uppermost flat plate, both of which may be used separately or joined together, depending on the individual application requirements. This device allows for the efficient removal of heat from a variety of electronic components, as the flat plate serves as an effective radiator to dissipate the heat into the surrounding ambient environment.
The combination of the base plate and upper plate of the ATS-17D-24-C2-R0 ensures a high level of thermal uniformity across the entire surface, reducing the potential for any hot spots or over temperature failures. This device also enables efficient heat transfer from high temperature areas to low temperature areas, minimising thermal resistance and improving overall performance. The flat plate of the ATS-17D-24-C2-R0 assists in heat distribution across the component, by increasing convective and radiant heat transfer.
One of the main advantages of the ATS-17D-24-C2-R0 is that it offers a low profile design. This is due to its integrated base plate and upper plate construction which ensure minimal overall height. This model also offers a high level of durability, due to its thick surface material which can withstand significant amounts of force. Furthermore, this device features a flexible mounting option which can be easily adjusted to optimise the efficiency of the application.
The ATS-17D-24-C2-R0 is not only suitable for cooling electronic components but can also be used as a heat transfer medium in battery thermal management systems. This device can be used to absorb and store thermal energy, creating an effective balance between charging and discharging cycles; this helps to protect and maintain battery cells by minimising damage caused by overheating or overcharging. Ultimately, this will increase the longevity of battery cells.
In conclusion, the ATS-17D-24-C2-R0 is a versatile thermal-heat sink device with multiple application fields. Its combination of an integrated base plate and flat plate offers high levels of thermal uniformity as well as efficient heat transfer from a variety of electronic components. This device also features a low profile and durable design, allowing for easy adjustable mounting and long-term reliability. Furthermore, this product is suitable for use in battery thermal management systems, maximising the lifespan of the cells.
The specific data is subject to PDF, and the above content is for reference