ATS-17D-27-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-27-C1-R0-ND

Manufacturer Part#:

ATS-17D-27-C1-R0

Price: $ 5.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-27-C1-R0 datasheetATS-17D-27-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.39028
30 +: $ 5.09061
50 +: $ 4.79128
100 +: $ 4.49177
250 +: $ 4.19232
500 +: $ 3.89287
1000 +: $ 3.81801
Stock 1000Can Ship Immediately
$ 5.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.23°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The range of applications and working principles for the ATS-17D-27-C1-R0 thermal heatsink are expansive and varied. Such a versatile product is an effective solution for a number of applications, using a variety of technologies.The ATS-17D-27-C1-R0 is an aluminium heat sink designed for cooling applications where a high thermal conductivity is required. It features an integrated fin design, which is highly efficient for dissipating heat away from the device surface. The fin—or rib—configuration optimizes heat exchange by increasing its surface area. The result is an innovative product, offering superior performance.The ATS-17D-27-C1-R0 can be utilized in a variety of systems and scenarios. Its adaptable design allows the heat sink to be fitted as an air or liquid cooled system.When used in an air cooled system, the total area of the cooling component should be adjusted accordingly. This is due to the amount of air flow entering the system, which should result in an increased airflow to achieve maximum cooling performance.When used in a liquid cooled system, a liquid-to-air heat exchanger is generally used to connect the different components of the system. The heat exchanger provides a medium for transferring heat from the liquid-cooled component to the ATS-17D-27-C1-R0. A variety of fluids can be used to cool the device, according to the application requirements. Such fluids include water, ethylene glycol, mineral oil and others.In addition to its thermally conductive nature, the ATS-17D-27-C1-R0 also benefits from its modular design. The modularity allows for different configurations to be readily customized to the user\'s requirements. The device can be configured to fit various sockets, making it suitable for a variety of installed equipment.The ATS-17D-27-C1-R0 is also customizable in terms of performance. The product can be designed to suit the specific cooling needs of the application.This versatility and ability to tailor the product\'s performance to the needs of the application renders the ATS-17D-27-C1-R0 as suitable for a range of scenarios. It is suitable for a variety of cooling critical applications in aerospace, medical, industrial and automotive sectors.The ATS-17D-27-C1-R0 can be found in applications ranging from power electronics, radio transmission, cooling in machines, computers, displays and telecommunication systems, to LED operations.In conclusion, the ATS-17D-27-C1-R0 is an effective and efficient thermal heatsink with a range of applications and working principles. Its versatility and adaptability allows the product to be tailored for any number of cooling requirements, making it a viable and affordable option when used for cooling devices with even the most demanding working conditions.

The specific data is subject to PDF, and the above content is for reference

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