| Allicdata Part #: | ATS-17D-44-C3-R0-ND |
| Manufacturer Part#: |
ATS-17D-44-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-44-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an issue that has been present since long before electricity was even developed. As the complexity of electronics and computer systems have increased, so too have the needs for effective thermal management solutions that are both reliable and cost effective.
One such solution is the ATS-17D-44-C3-R0 thermal – heat sink. This device is designed to dissipate heat generated by electronic components quickly and efficiently, allowing for the smooth operation of systems and components. Here, we will discuss the ATS-17D-44-C3-R0 application field and working principle.
Application Field:
The ATS-17D-44-C3-R0 thermal – heat sink is used in a variety of applications, from a small heat generating device to a large heat generating power board or motherboard. It is suitable for cooling electrical components and providing thermal protection for the system. This device has a wide range of operating temperatures, with a maximum temperature up to 150℃.
The ATS-17D-44-C3-R0 is particularly suitable for high power density or high temperature circuit boards, as it allows heat to dissipate quickly and evenly in the most efficient manner possible. Additionally, it is able to withstand vibration, shock, and high temperature fluctuations, making it the ideal choice for applications requiring reliable and stable heat dissipations.
Working Principle:
The ATS-17D-44-C3-R0 is a thermal – heat sink designed to optimize airflow and achieve heat dissipation quickly and efficiently. This device is composed of an aluminum alloy heat sink and a number of fins, which are designed to optimize the passage of thermal energy. The fins are arranged in a way that maximizes the contact surface area between the heated material and the heat sink, allowing for greater heat dissipation.
At the same time, an air cooling fan is employed to blow the heated air out of the system. The fan operates with a variable voltage, thereby providing the user with optimal control over the speed and performance of the heat sink. Additionally, the fan blades are designed to produce strong suction and maximize cooling results.
Finally, the ATS-17D-44-C3-R0 incorporates a special heat transfer paste, which helps to ensure efficient heat transfer between the heated material and the heat sink. This paste has been specially developed to provide maximum heat dissipation, while at the same time maintaining a consistent operational temperature.
In summary, the ATS-17D-44-C3-R0 thermal – heat sink is an effective and reliable solution for cooling electronics and other heat generating components. It is suitable for a wide range of applications and provides the user with optimal control over the speed and performance of the device. Additionally, the inclusion of a special heat transfer paste allows for maximum heat dissipation, while maintaining operational temperature stability.
The specific data is subject to PDF, and the above content is for reference